公开(公告)号：US08729999B2

公开(公告)日：2014-05-20

申请号：US13660543

申请日：2012-10-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Woo Hahn ,  Sung Yong An ,  Soo Hwan Son ,  Ic Seob Kim ,  Byeong Cheol Moon

IPC: H01F5/00 ,  H01F27/24 ,  H01F27/30

CPC classification number: H01F17/0033 ,  H01F17/0013 ,  H01F27/292

Abstract: There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1≦Ts:Te≦0.3 is satisfied.

Abstract translation: 提供了一种多层芯片电子部件，包括：多层体，包括形成有导电图案的多个第一磁性层; 以及介于所述多层体内的所述第一磁性层之间的第二磁性层，其中所述导电图案电连接以在层叠方向上形成线圈图案，并且当所述第二磁性层的厚度被定义为Ts时， 导电图形被定义为Te，0.1＆nlE; Ts：Te＆nlE; 0.3。

公开(公告)号：US10236104B2

公开(公告)日：2019-03-19

申请号：US14271968

申请日：2014-05-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Il Lee ,  Byeong Cheol Moon ,  So Yeon Song ,  Ic Seob Kim ,  Soo Hwan Son

IPC: H01F1/01 ,  H01F1/34 ,  H01F17/00 ,  H01F17/04 ,  H01F27/245 ,  H01F27/29 ,  C04B35/26

Abstract: An inductor is provided including a multilayer body in which a plurality of magnetic layers containing a ferrite are laminated. A coil part including a plurality of conductive patterns is disposed in the multilayer body. External electrodes are electrically connected to the coil part. The ferrite may contain iron (Fe), manganese (Mn), nickel (Ni), zinc (Zn), and vanadium (V), and the ferrite may contain 40 to 55 mol % of iron (Fe) calculated as iron oxide (Fe2O3), 5 to 20 mol % of nickel (Ni) calculated as nickel oxide (NiO), 15 to 25 mol % of zinc (Zn) calculated as zinc oxide (ZnO), 15 to 30 mol % of manganese (Mn) calculated as manganese oxide (MnO), and 1 to 4 mol % of vanadium (V) calculated as vanadium oxide (V2O5).

公开(公告)号：US09349512B2

公开(公告)日：2016-05-24

申请号：US13633544

申请日：2012-10-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo Hahn ,  Myeong Gi Kim ,  Sung Yong An ,  Ic Seob Kim ,  Byeong Cheol Moon

IPC: H01F5/00 ,  H01F27/28 ,  H01F3/14 ,  H01F17/00 ,  H01F27/29

CPC classification number: H01F3/14 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/292

Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 μm≦Tg≦7 μm, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.

Abstract translation: 提供一种多层芯片电子部件，其包括：包括2016尺寸以下的多层磁性层的多层体; 导电图案在堆叠方向上电连接以形成多层体内的线圈图案; 以及形成在多层磁性层之间的层叠多层体的层叠表面上并且具有在1μm和n1E范围内的厚度Tg的非磁隙层; Tg＆lt; 1lE;7μm，其中非磁隙层数 可以具有在磁性层中的至少四层之间的范围内的间隙层的数量和线圈图案的匝数。

公开(公告)号：US20240355536A1

公开(公告)日：2024-10-24

申请号：US18581907

申请日：2024-02-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： No Il Park ,  In Young Kang ,  Ic Seob Kim

IPC: H01F27/29 ,  H01F27/30 ,  H01F41/04

CPC classification number: H01F27/292 ,  H01F27/306 ,  H01F41/041

Abstract: A coil component according to an embodiment of the present disclosure may include: a body having a first surface and a second surface and each having a recess formed therein, and a third surface and a fourth surface; a support member; a coil including first and second coil portions disposed on the support member, an internal via for connecting the first and second coil portions, a first lead-out portion extending from an outermost turn of the first coil portion, a first sub lead-out portion, a first external via for connecting the first lead-out portion and the first sub lead-out portion, and a second lead-out portion extending from an outermost turn of the second coil portion; a first external electrode; and a second external electrode, wherein at least a portion of the first external via may be in contact with the first external electrode.

公开(公告)号：US09378884B2

公开(公告)日：2016-06-28

申请号：US14201379

申请日：2014-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ic Seob Kim ,  Ho Yoon Kim ,  Myeong Gi Kim

IPC: H01F5/00 ,  H01F27/28 ,  H01F41/00 ,  H01F27/24 ,  H01F27/00 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F5/00 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/00 ,  H01F27/24 ,  H01F41/005 ,  H01F41/046 ,  H01F2027/2809 ,  Y10T29/4902

Abstract: There are provided a multilayer electronic component and a method of manufacturing the same. More particularly, there are provided a multilayer electronic component capable of maintaining high inductance at a high frequency due to excellent magnetic properties and having excellent DC bias properties and a dense fine structure to thereby improve strength, and a method of manufacturing the same.

Abstract translation: 提供了一种多层电子部件及其制造方法。 更具体地说，提供了一种能够由于优异的磁性能而具有高频率的高电感并且具有优异的DC偏置特性和致密精细结构从而提高强度的多层电子部件及其制造方法。

公开(公告)号：US20140240078A1

公开(公告)日：2014-08-28

申请号：US14269872

申请日：2014-05-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Yong An ,  Myeong Gi Kim ,  Ic Seob Kim

IPC: H01F27/255

CPC classification number: H01F1/01 ,  H01F1/33 ,  H01F1/36 ,  H01F17/04 ,  H01F27/255

Abstract: Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz.

公开(公告)号：US10706994B2

公开(公告)日：2020-07-07

申请号：US16535434

申请日：2019-08-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ic Seob Kim ,  Jung Il Kim ,  Yong Sung Kim ,  Eun Ju Oh ,  Su Rim Bae ,  Hae In Kim

IPC: H01C7/112 ,  H01C7/10 ,  H01C7/12 ,  H01G4/005 ,  H01L27/02 ,  H01G2/06 ,  H01C13/02

Abstract: A varistor includes a varistor body, a first terminal disposed on one side of the varistor body, a second terminal disposed on the other side of the varistor body, a first electrode disposed on an upper portion of the varistor body, electrically connected to the first terminal, and extending towards the other side of the varistor body, and a second electrode disposed on a lower portion of the varistor body, electrically connected to the second terminal, and extending towards the one side of the varistor body.

公开(公告)号：US09894768B2

公开(公告)日：2018-02-13

申请号：US14289025

申请日：2014-05-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ic Seob Kim ,  Soo Hwan Son ,  Yu Jin Choi ,  Ho Yoon Kim ,  Myeong Gi Kim ,  So Yeon Song ,  Min Kyoung Cheon ,  Byeong Cheol Moon ,  Young Il Lee

IPC: H01F5/00 ,  H01F17/04 ,  H01F27/24 ,  H05K1/18 ,  H01F17/00 ,  H01F41/04 ,  H01F1/22 ,  H01F27/255

CPC classification number: H05K1/181 ,  H01F1/22 ,  H01F17/0013 ,  H01F27/255 ,  H01F41/046 ,  H01F2017/0066

Abstract: A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.

公开(公告)号：US20150022305A1

公开(公告)日：2015-01-22

申请号：US14271968

申请日：2014-05-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young II Lee ,  Byeong Cheol Moon ,  So Yeon Song ,  Ic Seob Kim ,  Soo Hwan Son

IPC: H01F1/01 ,  H01F27/245 ,  H01F27/29

CPC classification number: H01F1/01 ,  C04B35/26 ,  C04B2235/3239 ,  C04B2235/3262 ,  C04B2235/3279 ,  C04B2235/3284 ,  C04B2235/656 ,  C04B2235/85 ,  H01F1/344 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/245 ,  H01F27/29 ,  H01F27/292

Abstract: An inductor is provided including a multilayer body in which a plurality of magnetic layers containing a ferrite are laminated. A coil part including a plurality of conductive patterns is disposed in the multilayer body. External electrodes are electrically connected to the coil part. The ferrite may contain iron (Fe), manganese (Mn), nickel (Ni), zinc (Zn), and vanadium (V), and the ferrite may contain 40 to 55 mol % of iron (Fe) calculated as iron oxide (Fe2O3), 5 to 20 mol % of nickel (Ni) calculated as nickel oxide (NiO), 15 to 25 mol % of zinc (Zn) calculated as zinc oxide (ZnO), 15 to 30 mol % of manganese (Mn) calculated as manganese oxide (MnO), and 1 to 4 mol % of vanadium (V) calculated as vanadium oxide (V2O5).

Abstract translation: 提供一种电感器，其包括层叠有多个含有铁素体的磁性层的多层体。 包括多个导电图案的线圈部分设置在多层体中。 外部电极与线圈部电连接。 铁素体可以含有铁（Fe），锰（Mn），镍（Ni），锌（Zn）和钒（V），铁素体可以含有40〜55mol％的铁（Fe） Fe2O3），计算为氧化镍（NiO）的5〜20摩尔％的镍（Ni），计算为氧化锌（ZnO）的15〜25摩尔％的锌（Zn），计算出的锰为15〜30摩尔％ 作为氧化锰（MnO）和1〜4mol％的钒（V），其计算为氧化钒（V2O5）。