Invention Grant
US09383403B2 TSVs connected to ground and combined stimulus and testing leads
有权
连接到地面的TSV和组合的刺激和测试线索
- Patent Title: TSVs connected to ground and combined stimulus and testing leads
- Patent Title (中): 连接到地面的TSV和组合的刺激和测试线索
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Application No.: US13785284Application Date: 2013-03-05
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Publication No.: US09383403B2Publication Date: 2016-07-05
- Inventor: Lee D. Whetsel , Baher S. Haroun
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; Frank D. Cimino
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/3185
Abstract:
This disclosure describes a novel method and apparatus for testing TSVs within a semiconductor device. According to embodiments illustrated and described in the disclosure, a TSV may be tested by stimulating and measuring a response from a first end of a TSV while the second end of the TSV held at ground potential. Multiple TSVs within the semiconductor device may be tested in parallel to reduce the TSV testing time according to the disclosure.
Public/Granted literature
- US20130249590A1 TSV Testing Using Test Circuits and Grounding Means Public/Granted day:2013-09-26
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