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公开(公告)号:US12092687B2
公开(公告)日:2024-09-17
申请号:US18373447
申请日:2023-09-27
发明人: Lee D. Whetsel
IPC分类号: G01R31/28 , G01R31/317 , G01R31/3177 , G01R31/3185 , G06F11/267 , G06F11/27 , G06F11/26 , G06F11/34
CPC分类号: G01R31/31723 , G01R31/31722 , G01R31/31725 , G01R31/31727 , G01R31/3177 , G01R31/318572 , G06F11/267 , G06F11/27 , G06F11/261 , G06F11/3466
摘要: An address and command port interface selectively enables JTAG TAP domain operations and Trace domain operations within an IC. The port carries TMS and TDI input and TDO output on a single pin and receives a clock signal on a separate pin. The addressable two pin interface loads and updates instructions and data to the TAP domain within the IC. The instruction or data update operations in multiple ICs occur simultaneously. A process transmits data from an addressed target device to a controller using data frames, each data frame comprising a header bit and data bits. The logic level of the header bit is used to start, continue, and stop the data transmission to the controller. A data and clock signal interface between a controller and multiple target devices provides for each target device to be individually addressed and commanded to perform a JTAG or Trace operation.
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公开(公告)号:US12013434B2
公开(公告)日:2024-06-18
申请号:US18102955
申请日:2023-01-30
发明人: Lee D. Whetsel
IPC分类号: G01R31/3183 , G01R31/317 , G01R31/3177 , G01R31/3185 , G06F11/273
CPC分类号: G01R31/318335 , G01R31/3172 , G01R31/31723 , G01R31/31727 , G01R31/3177 , G01R31/318547 , G06F11/2733
摘要: The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer's system. Additional embodiments are also provided and described in the disclosure.
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公开(公告)号:US12007441B2
公开(公告)日:2024-06-11
申请号:US18208366
申请日:2023-06-12
发明人: Lee D. Whetsel
IPC分类号: G01R31/3185 , G01R31/317 , G01R31/3177
CPC分类号: G01R31/318555 , G01R31/31723 , G01R31/31724 , G01R31/31725 , G01R31/3177 , G01R31/318508 , G01R31/318513 , G01R31/318597
摘要: This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.
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公开(公告)号:US11835578B2
公开(公告)日:2023-12-05
申请号:US17579629
申请日:2022-01-20
发明人: Lee D. Whetsel
IPC分类号: G01R31/28 , G01R31/317 , G06F11/27 , G01R31/3185 , G01R31/3177 , G06F11/267 , G06F11/26 , G06F11/34
CPC分类号: G01R31/31723 , G01R31/3177 , G01R31/31722 , G01R31/31725 , G01R31/31727 , G01R31/318572 , G06F11/267 , G06F11/27 , G06F11/261 , G06F11/3466
摘要: An address and command port interface selectively enables JTAG TAP domain operations and Trace domain operations within an IC. The port carries TMS and TDI input and TDO output on a single pin and receives a clock signal on a separate pin. The addressable two pin interface loads and updates instructions and data to the TAP domain within the IC. The instruction or data update operations in multiple ICs occur simultaneously. A process transmits data from an addressed target device to a controller using data frames, each data frame comprising a header bit and data bits. The logic level of the header bit is used to start, continue, and stop the data transmission to the controller. A data and clock signal interface between a controller and multiple target devices provides for each target device to be individually addressed and commanded to perform a JTAG or Trace operation.
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公开(公告)号:US11835573B2
公开(公告)日:2023-12-05
申请号:US17557512
申请日:2021-12-21
发明人: Lee D. Whetsel
IPC分类号: G01R31/28 , G01R31/3185 , H01L21/66 , H01L23/538 , H01L23/522 , H01L23/48
CPC分类号: G01R31/2853 , G01R31/2884 , G01R31/318541 , H01L22/34 , H01L23/5226 , H01L23/5384 , H01L23/481 , H01L2224/16146
摘要: An integrated circuit die includes a substrate of semiconductor material having a top surface, a bottom surface, and an opening through the substrate between the top surface and the bottom surface. A through silicon via (TSV) has a conductive body in the opening, has a top contact point coupled to the body at the top surface, and has a bottom contact point coupled to the body at the bottom surface. A scan cell has a serial input, a serial output, control inputs, a voltage reference input, a response input coupled to one of the contact points, and a stimulus output coupled to the other one of the contact points.
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公开(公告)号:US11808810B2
公开(公告)日:2023-11-07
申请号:US18111679
申请日:2023-02-20
发明人: Lee D. Whetsel
IPC分类号: G01R31/3185 , G06F11/26 , G01R31/3177 , H10K50/814 , H10K50/816 , H10K50/844 , H10K59/122 , H10K59/123 , H10K59/124 , H10K59/121 , H10K71/00 , G01R31/317 , H10K59/12 , H10K102/00 , H10K102/10 , H01L27/12
CPC分类号: G01R31/3177 , G01R31/31723 , G01R31/31727 , G01R31/318555 , G01R31/318572 , G06F11/26 , H10K50/814 , H10K50/816 , H10K50/844 , H10K59/122 , H10K59/123 , H10K59/124 , H10K59/1213 , H10K71/00 , H01L27/1222 , H01L27/1225 , H01L27/1248 , H10K59/1201 , H10K2102/00 , H10K2102/103
摘要: In some examples, an integrated circuit comprises: a TDI input, a TDO output, a TCK input and a TMS input; a TAP state machine (TSM) having an input coupled to the TCK input, an input coupled to the TMS input, an instruction register control output, a TSM data register control (DRC) output, and a TSM state output; an instruction register having an input coupled to the TDI input, an output coupled to the TDO output, and a control input coupled to the instruction register control output of the TAP state machine; router circuitry including a TSM DRC input coupled to the TSM DRC output, a control DRC input coupled to the TSM state output, and a router DRC output; and a data register having an input coupled to the TDI input, an output coupled to the TDO output, and a data register DRC input coupled to the router DRC output.
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公开(公告)号:US20230296670A1
公开(公告)日:2023-09-21
申请号:US18200047
申请日:2023-05-22
发明人: Lee D. Whetsel
IPC分类号: G01R31/3177 , G01R31/3185 , G01R31/317
CPC分类号: G01R31/3177 , G01R31/318533 , G01R31/31723 , G01R31/31725 , G01R31/31727
摘要: The disclosure describes a novel method and apparatuses for allowing a controller to select and access different types of access ports in a device. The selecting and accessing of the access ports is achieved using only the dedicated TDI, TMS, TCK, and TDO signal terminals of the device. The selecting and accessing of device access ports can be achieved when a single device is connected to the controller, when multiple devices are placed in a daisy-chain arrangement and connected to the controller, or when multiple devices are placed in a addressable parallel arrangement and connected to the controller. Additional embodiments are also provided and described in the disclosure.
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公开(公告)号:US11747397B2
公开(公告)日:2023-09-05
申请号:US17508750
申请日:2021-10-22
发明人: Lee D. Whetsel
IPC分类号: G01R31/3177 , G01R31/3185 , G01R31/317
CPC分类号: G01R31/3177 , G01R31/31723 , G01R31/31727 , G01R31/318555 , G01R31/318572
摘要: The disclosure describes a novel method and apparatus for making device TAPs addressable to allow device TAPs to be accessed in a parallel arrangement without the need for having a unique TMS signal for each device TAP in the arrangement. According to the disclosure, device TAPs are addressed by inputting an address on the TDI input of devices on the falling edge of TCK. An address circuit within the device is associated with the device's TAP and responds to the address input to either enable or disable access of the device's TAP.
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公开(公告)号:US11726135B2
公开(公告)日:2023-08-15
申请号:US17858122
申请日:2022-07-06
发明人: Lee D. Whetsel
IPC分类号: G01R31/26 , G01R31/3177 , G01R31/3185
CPC分类号: G01R31/2607 , G01R31/3177 , G01R31/318513 , G01R31/318558 , G01R31/318572 , G01R31/318552 , G01R31/318594
摘要: A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.
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公开(公告)号:US20230194604A1
公开(公告)日:2023-06-22
申请号:US18111679
申请日:2023-02-20
发明人: Lee D. Whetsel
IPC分类号: G01R31/3177 , G01R31/3185 , H10K50/814 , H10K50/816 , H10K50/844 , H10K59/122 , H10K59/123 , H10K59/124 , H10K59/121 , H10K71/00 , G06F11/26 , G01R31/317
CPC分类号: G01R31/3177 , G01R31/318555 , G01R31/318572 , H10K50/814 , H10K50/816 , H10K50/844 , H10K59/122 , H10K59/123 , H10K59/124 , H10K59/1213 , H10K71/00 , G06F11/26 , G01R31/31723 , G01R31/31727 , H10K59/1201
摘要: In some examples, an integrated circuit comprises: a TDI input, a TDO output, a TCK input and a TMS input; a TAP state machine (TSM) having an input coupled to the TCK input, an input coupled to the TMS input, an instruction register control output, a TSM data register control (DRC) output, and a TSM state output; an instruction register having an input coupled to the TDI input, an output coupled to the TDO output, and a control input coupled to the instruction register control output of the TAP state machine; router circuitry including a TSM DRC input coupled to the TSM DRC output, a control DRC input coupled to the TSM state output, and a router DRC output; and a data register having an input coupled to the TDI input, an output coupled to the TDO output, and a data register DRC input coupled to the router DRC output.
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