Invention Grant
US09384770B2 Near-field transducer with enlarged region, peg region, and heat sink region
有权
近场传感器具有扩大的区域,钉区域和散热片区域
- Patent Title: Near-field transducer with enlarged region, peg region, and heat sink region
- Patent Title (中): 近场传感器具有扩大的区域,钉区域和散热片区域
-
Application No.: US13961638Application Date: 2013-08-07
-
Publication No.: US09384770B2Publication Date: 2016-07-05
- Inventor: Weibin Chen , Chubing Peng , Werner Scholz
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: G11B13/08
- IPC: G11B13/08 ; G11B5/60 ; G11B5/31 ; G11B5/00

Abstract:
A near-field transducer includes an enlarged region having a top side adjacent to a magnetic pole, a base side opposite the top side, and a circumference that extends from proximal to a media-facing surface to distal to a media-facing surface. The near-field transducer includes a peg region in contact with a region of the base side of the enlarged region, the peg region extending from the enlarged region towards the media-facing surface. The near-field transducer also includes a heat sink region having a contact side, a base side, and a circumference that extends from proximal to the media-facing surface to distal from the media-facing surface. The contact side of the heat sink region is in thermal contact with both the peg region and at least a region of the base side of the enlarged region.
Public/Granted literature
- US20150043315A1 NEAR-FIELD TRANSDUCER WITH ENLARGED REGION, PEG REGION, AND HEAT SINK REGION Public/Granted day:2015-02-12
Information query
IPC分类: