Invention Grant
- Patent Title: Nested through glass via transformer
- Patent Title (中): 通过变压器嵌套通过玻璃
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Application No.: US14155172Application Date: 2014-01-14
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Publication No.: US09384883B2Publication Date: 2016-07-05
- Inventor: Daeik Daniel Kim , Jonghae Kim , Chengjie Zuo , Mario Francisco Velez , Changhan Hobie Yun
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Seyfarth Shaw LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F41/00 ; H01F17/00

Abstract:
A 3D nested transformer includes a substrate having a set of through substrate vias daisy chained together with a set of traces. At least some of the through substrate vias have first and second conductive regions. The set of traces also includes a first set of traces coupling together at least some of the first conductive regions of the through substrate vias, and a second set of traces coupling together at least some of the second conductive regions of the through substrate vias.
Public/Granted literature
- US20150200049A1 NESTED THROUGH GLASS VIA TRANSFORMER Public/Granted day:2015-07-16
Information query