发明授权
- 专利标题： Integrated circuit packaging system with surface treatment and method of manufacture thereof
- 专利标题（中）： 具有表面处理的集成电路封装系统及其制造方法
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申请号： US14659905申请日： 2015-03-17
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公开(公告)号： US09385100B1公开(公告)日： 2016-07-05
- 发明人: Hun Teak Lee , YoungChul Kim , Hyunll Bae , HeeSoo Lee , HeeJo Chi
- 申请人： Hun Teak Lee , YoungChul Kim , Hyunll Bae , HeeSoo Lee , HeeJo Chi
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Pte. Ltd.
- 当前专利权人： STATS ChipPAC Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Wong & Rees LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/00 ; H01L21/56
摘要：
An integrated circuit packaging system, and a method of manufacture thereof, includes: an embedded trace substrate having bonding sites and traces embedded in a base material, an insulation layer on the traces, the insulation layer having a top surface coplanar with the top surface of the base material; and an integrated circuit die connected to the bonding sites.
信息查询
IPC分类:
