Invention Grant
- Patent Title: Chip and method for manufacturing a chip
- Patent Title (中): 用于制造芯片的芯片和方法
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Application No.: US14254913Application Date: 2014-04-17
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Publication No.: US09385726B2Publication Date: 2016-07-05
- Inventor: Thomas Kuenemund , Bernhard Lippmann
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H03K19/21
- IPC: H03K19/21 ; H01L27/02 ; H01L27/118 ; H03K19/177 ; H01L23/00 ; H01L21/70 ; H01L27/088 ; H01L27/092

Abstract:
According to one embodiment, a chip is described comprising a plurality of supply lines delimiting a plurality of cell areas and a gate comprising a first transistor and a second transistor, wherein the first transistor is located in a first cell area of the plurality of cell areas and the second transistor is located in a second cell area of the plurality of cell areas such that a supply line of the plurality of supply lines lies between the first cell area and the second cell area.
Public/Granted literature
- US20150303927A1 CHIP AND METHOD FOR MANUFACTURING A CHIP Public/Granted day:2015-10-22
Information query
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