Invention Grant
- Patent Title: Method of forming electric wiring using inkjet printing
- Patent Title (中): 使用喷墨印刷形成电线的方法
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Application No.: US13861754Application Date: 2013-04-12
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Publication No.: US09386708B2Publication Date: 2016-07-05
- Inventor: Joong-hyuk Kim , Yong-wan Jin , Young-ki Hong , Sung-gyu Kang , Seung-ho Lee , Jin-seok Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0133149 20121122
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H05K3/12 ; C23C22/83 ; C23C22/78

Abstract:
Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench.
Public/Granted literature
- US20140141156A1 METHOD OF FORMING ELECTRIC WIRING USING INKJET PRINTING Public/Granted day:2014-05-22
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