Invention Grant
US09389227B2 Solid substrate comprising array of dendrons and methods for using the same
有权
包括树突的阵列的固体底物及其使用方法
- Patent Title: Solid substrate comprising array of dendrons and methods for using the same
- Patent Title (中): 包括树突的阵列的固体底物及其使用方法
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Application No.: US12102794Application Date: 2008-04-14
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Publication No.: US09389227B2Publication Date: 2016-07-12
- Inventor: Joon Won Park , Bong Jin Hong
- Applicant: Joon Won Park , Bong Jin Hong
- Applicant Address: KR Pohang-Si, Kyungsangbuk-Do KR Pohang, Kyungsangbuk-Do
- Assignee: POSCO,POSTECH FOUNDATION
- Current Assignee: POSCO,POSTECH FOUNDATION
- Current Assignee Address: KR Pohang-Si, Kyungsangbuk-Do KR Pohang, Kyungsangbuk-Do
- Agency: Hamilton DeSanctis & Cha, LLP
- Agent Don D. Cha
- Main IPC: C12M1/34
- IPC: C12M1/34 ; C12M1/00 ; C12Q1/68 ; C07H21/02 ; C07H21/04 ; C40B30/04 ; G01N33/543 ; C40B50/18
Abstract:
The present invention provides solid supports comprising a surface bound array of dendrons and methods for using the same.
Public/Granted literature
- US20100093553A1 Solid Substrate Comprising Array of Dendrons and Methods for Using the Same Public/Granted day:2010-04-15
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