Invention Grant
US09389505B2 Polymerizable composition for solder resist, and solder resist pattern formation method
有权
用于阻焊剂的可聚合组合物和阻焊剂图案形成方法
- Patent Title: Polymerizable composition for solder resist, and solder resist pattern formation method
- Patent Title (中): 用于阻焊剂的可聚合组合物和阻焊剂图案形成方法
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Application No.: US13575551Application Date: 2010-12-09
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Publication No.: US09389505B2Publication Date: 2016-07-12
- Inventor: Kazuto Shimada , Kimi Ikeda , Yoshiharu Yabuki , Daisuke Arioka
- Applicant: Kazuto Shimada , Kimi Ikeda , Yoshiharu Yabuki , Daisuke Arioka
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-016041 20100127; JP2010-115725 20100519; JP2010-271640 20101206
- International Application: PCT/JP2010/072154 WO 20101209
- International Announcement: WO2011/092950 WO 20110804
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/20 ; G03F7/032 ; G03F1/56 ; G03F7/027 ; G03F7/033 ; G03F7/105 ; H05K3/34
Abstract:
The present invention provides a polymerizable composition for a solder resist, including an infrared ray shielding material, a polymerization initiator, and a polymerizable compound, and a solder resist pattern forming method using the polymerizable composition for a solder resist.
Public/Granted literature
- US20130034812A1 POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD Public/Granted day:2013-02-07
Information query
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