发明授权
- 专利标题： Packaging methods, material dispensing methods and apparatuses, and automated measurement systems
- 专利标题（中）： 包装方法，材料分配方法和装置以及自动测量系统
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申请号： US13420383申请日： 2012-03-14
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公开(公告)号： US09390060B2公开(公告)日： 2016-07-12
- 发明人: Chien Rhone Wang , Chih-Wei Lai , Chih-Chiang Chang , Kewei Zuo , Jing-Cheng Lin
- 申请人： Chien Rhone Wang , Chih-Wei Lai , Chih-Chiang Chang , Kewei Zuo , Jing-Cheng Lin
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G06F17/00 ; H01L23/00 ; H01L25/065
摘要：
Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.