发明授权
- 专利标题: Handle substrate and composite wafer for semiconductor device
- 专利标题(中): 处理半导体器件的基板和复合晶片
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申请号: US14829808申请日: 2015-08-19
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公开(公告)号: US09390955B2公开(公告)日: 2016-07-12
- 发明人: Tatsuro Takagaki , Yasunori Iwasaki , Sugio Miyazawa , Akiyoshi Ide , Hirokazu Nakanishi
- 申请人: NGK INSULATORS, LTD.
- 申请人地址: JP Aichi-prefecture
- 专利权人: NGK INSULATORS, LTD.
- 当前专利权人: NGK INSULATORS, LTD.
- 当前专利权人地址: JP Aichi-prefecture
- 代理机构: Cermak Nakajima & McGowan LLP
- 代理商 Tomoko Nakajima
- 优先权: JP2014-000246 20140106
- 主分类号: H01L21/683
- IPC分类号: H01L21/683 ; H01L29/16 ; C30B29/06 ; C04B35/115 ; C04B35/111 ; H01L27/12
摘要:
In a handle substrate for a composite wafer for a semiconductor, particles from the wafer with a notch formed therein are reduced. The handle substrate 1A or 1B for the composite wafer for the semiconductor is formed of a polycrystalline ceramic sintered body, and includes a notch 2A or 2B in its outer peripheral portion. The notch is formed with an as-sintered surface.
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