发明授权
US09390955B2 Handle substrate and composite wafer for semiconductor device 有权
处理半导体器件的基板和复合晶片

Handle substrate and composite wafer for semiconductor device
摘要:
In a handle substrate for a composite wafer for a semiconductor, particles from the wafer with a notch formed therein are reduced. The handle substrate 1A or 1B for the composite wafer for the semiconductor is formed of a polycrystalline ceramic sintered body, and includes a notch 2A or 2B in its outer peripheral portion. The notch is formed with an as-sintered surface.
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