Invention Grant
US09390992B2 Semiconductor packages including a metal layer between first and second semiconductor chips
有权
包括第一和第二半导体芯片之间的金属层的半导体封装
- Patent Title: Semiconductor packages including a metal layer between first and second semiconductor chips
- Patent Title (中): 包括第一和第二半导体芯片之间的金属层的半导体封装
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Application No.: US14289814Application Date: 2014-05-29
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Publication No.: US09390992B2Publication Date: 2016-07-12
- Inventor: Heungkyu Kwon , Sangho An
- Applicant: Heungkyu Kwon , Sangho An
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2013-0081632 20130711
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L23/31 ; H01L23/498 ; H01L23/552 ; H01L25/065 ; H01L25/10 ; H01L23/00
Abstract:
Semiconductor packages are provided. A semiconductor package may include a wiring board and a first semiconductor chip on the wiring board. Moreover, the semiconductor package may include a metal layer on the first semiconductor chip and a second semiconductor chip on the metal layer. The metal layer may be between the first and second semiconductor chips.
Public/Granted literature
- US20150014862A1 SEMICONDUCTOR PACKAGES INCLUDING A METAL LAYER BETWEEN FIRST AND SECOND SEMICONDUCTOR CHIPS Public/Granted day:2015-01-15
Information query
IPC分类:
