公开(公告)号：US20150014862A1

公开(公告)日：2015-01-15

申请号：US14289814

申请日：2014-05-29

申请人： Heungkyu Kwon ,  Sangho An

发明人： Heungkyu Kwon ,  Sangho An

IPC分类号： H01L23/00 ,  H01L23/528

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Semiconductor packages are provided. A semiconductor package may include a wiring board and a first semiconductor chip on the wiring board. Moreover, the semiconductor package may include a metal layer on the first semiconductor chip and a second semiconductor chip on the metal layer. The metal layer may be between the first and second semiconductor chips.

摘要翻译： 提供半导体封装。 半导体封装可以包括布线​​板和布线板上的第一半导体芯片。 此外，半导体封装可以包括第一半导体芯片上的金属层和金属层上的第二半导体芯片。 金属层可以在第一和第二半导体芯片之间。

公开(公告)号：US09390992B2

公开(公告)日：2016-07-12

申请号：US14289814

申请日：2014-05-29

申请人： Heungkyu Kwon ,  Sangho An

发明人： Heungkyu Kwon ,  Sangho An

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Semiconductor packages are provided. A semiconductor package may include a wiring board and a first semiconductor chip on the wiring board. Moreover, the semiconductor package may include a metal layer on the first semiconductor chip and a second semiconductor chip on the metal layer. The metal layer may be between the first and second semiconductor chips.

摘要翻译： 提供半导体封装。 半导体封装可以包括布线​​板和布线板上的第一半导体芯片。 此外，半导体封装可以包括第一半导体芯片上的金属层和金属层上的第二半导体芯片。 金属层可以在第一和第二半导体芯片之间。

公开(公告)号：US09881827B2

公开(公告)日：2018-01-30

申请号：US14714225

申请日：2015-05-15

申请人： Geunwoo Kim ,  Seunghee Lee ,  Hyun Kim ,  Ohchul Kwon ,  Sangho An ,  Seonju Oh ,  Yun-Sik Yoo

发明人： Geunwoo Kim ,  Seunghee Lee ,  Hyun Kim ,  Ohchul Kwon ,  Sangho An ,  Seonju Oh ,  Yun-Sik Yoo

IPC分类号： B32B37/08 ,  H01L21/683 ,  B32B37/00 ,  B32B37/16 ,  H01L21/67 ,  B32B38/18 ,  B32B41/00 ,  B32B37/14 ,  G02F1/13 ,  B32B37/18 ,  B32B38/00 ,  B32B38/10

CPC分类号： H01L21/6836 ,  B32B37/0015 ,  B32B37/0053 ,  B32B37/08 ,  B32B37/144 ,  B32B37/16 ,  B32B37/18 ,  B32B38/0004 ,  B32B38/0036 ,  B32B38/10 ,  B32B38/164 ,  B32B38/18 ,  B32B38/1858 ,  B32B41/00 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2309/02 ,  B32B2457/14 ,  B32B2457/20 ,  B65H2301/517 ,  G02F1/1303 ,  H01L21/67109 ,  H01L21/67132 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10 ,  Y10T156/17

摘要： An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.