Invention Grant
US09391134B2 Fin field effect transistor, semiconductor device including the same and method of forming the semiconductor device
有权
鳍式场效应晶体管,包括其的半导体器件和形成半导体器件的方法
- Patent Title: Fin field effect transistor, semiconductor device including the same and method of forming the semiconductor device
- Patent Title (中): 鳍式场效应晶体管,包括其的半导体器件和形成半导体器件的方法
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Application No.: US14336084Application Date: 2014-07-21
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Publication No.: US09391134B2Publication Date: 2016-07-12
- Inventor: Chang-Jae Yang , Sang-Su Kim , Jae-Hwan Lee , Jung-Dal Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0091030 20130731
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/8238 ; H01L21/84 ; H01L27/092 ; H01L27/12

Abstract:
A fin field effect transistor includes a first fin structure and a second fin structures both protruding from a substrate, first and second gate electrodes on the first and second fin structures, respectively, and a gate dielectric layer between each of the first and second fin structures and the first and second gate electrodes, respectively. Each of the first and second fin structures includes a buffer pattern on the substrate, a channel pattern on the buffer pattern, and an etch stop pattern provided between the channel pattern and the substrate. The etch stop pattern includes a material having an etch resistivity greater than that of the buffer pattern.
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