Invention Grant
- Patent Title: Biomass photosensitive material and method for manufacturing the same, and printed circuit board
- Patent Title (中): 生物质感光材料及其制造方法以及印刷电路板
-
Application No.: US14792772Application Date: 2015-07-07
-
Publication No.: US09392688B2Publication Date: 2016-07-12
- Inventor: Man-Lin Chen , Hsien-Kuang Lin , Sue-May Chen , Su-Huey Chen , Yu-Lin Liu
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW103123273A 20140707
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/28 ; G03F7/038 ; H05K1/02

Abstract:
A method of forming a biomass photosensitive material is provided, which includes (1) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and (2) mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.
Public/Granted literature
- US20160004158A1 BIOMASS PHOTOSENSITIVE MATERIAL AND METHOD FOR MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD Public/Granted day:2016-01-07
Information query