Invention Grant
- Patent Title: Polishing method and polishing system
- Patent Title (中): 抛光方法和抛光系统
-
Application No.: US13198729Application Date: 2011-08-05
-
Publication No.: US09393665B2Publication Date: 2016-07-19
- Inventor: Yu-Piao Wang , Jen-Feng Cheng , Te-Yang Chen , Ya-Ling Chen
- Applicant: Yu-Piao Wang , Jen-Feng Cheng , Te-Yang Chen , Ya-Ling Chen
- Applicant Address: TW Taichung TW Hsinchu
- Assignee: IV TECHNOLOGIES CO., LTD.,POWERCHIP TECHNOLOGY CORPORATION
- Current Assignee: IV TECHNOLOGIES CO., LTD.,POWERCHIP TECHNOLOGY CORPORATION
- Current Assignee Address: TW Taichung TW Hsinchu
- Agency: Ditthavong & Steiner, P.C.
- Priority: TW100109552A 20110321
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B37/04 ; B24B37/10 ; B24B37/26
Abstract:
A polishing method and a polishing system are provided. By means of adjusting a rotational center of a polishing article corresponding to positions of a polishing pad or polishing pads, a polishing rate of the polishing article surface has a better uniformity, resulted from compensation of polishing rates at the rotational center of the polishing article.
Public/Granted literature
- US20120244785A1 POLISHING METHOD AND POLISHING SYSTEM Public/Granted day:2012-09-27
Information query
