POLISHING METHOD AND POLISHING SYSTEM
    2.
    发明申请
    POLISHING METHOD AND POLISHING SYSTEM 有权
    抛光方法和抛光系统

    公开(公告)号:US20120244785A1

    公开(公告)日:2012-09-27

    申请号:US13198729

    申请日:2011-08-05

    IPC分类号: B24B1/00

    摘要: A polishing method and a polishing system are provided. By means of adjusting a rotational center of a polishing article corresponding to positions of a polishing pad or polishing pads, a polishing rate of the polishing article surface has a better uniformity, resulted from compensation of polishing rates at the rotational center of the polishing article.

    摘要翻译: 提供了抛光方法和抛光系统。 通过调整与抛光垫或抛光垫的位置相对应的研磨制品的旋转中心,抛光物品表面的抛光速率由抛光物品的旋转中心的抛光速率的补偿得到更好的均匀性。