Invention Grant
- Patent Title: Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
- Patent Title (中): 芯片布置，芯片布置的制造方法，集成电路和集成电路的制造方法
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Application No.: US13742456Application Date: 2013-01-16
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Publication No.: US09397018B2Publication Date: 2016-07-19
- Inventor: Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Xaver Schloegel , Wolfram Hable , Manfred Mengel , Joachim Mahler , Khalil Hosseini
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/29 ; H01L21/56 ; H01L23/31 ; H01L23/06 ; H01L23/495 ; H01L23/00
Abstract:
A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material.
Public/Granted literature
Information query
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