Invention Grant
- Patent Title: Bond wire feed system and method therefor
- Patent Title (中): 债券送丝系统及其方法
-
Application No.: US14693881Application Date: 2015-04-23
-
Publication No.: US09397066B2Publication Date: 2016-07-19
- Inventor: Zhijie Wang , Zhigang Bai , Huchang Zhang
- Applicant: Zhijie Wang , Zhigang Bai , Huchang Zhang
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles E. Bergere
- Priority: CN201410858023 20141201
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H01L23/00 ; B23K31/12 ; B23K37/047 ; B23K20/00

Abstract:
A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.
Public/Granted literature
- US20160155718A1 BOND WIRE FEED SYSTEM AND METHOD THEREFOR Public/Granted day:2016-06-02
Information query
IPC分类: