Invention Grant
- Patent Title: Semiconductor device package and method of manufacturing the same
- Patent Title (中): 半导体器件封装及其制造方法
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Application No.: US14700079Application Date: 2015-04-29
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Publication No.: US09397074B1Publication Date: 2016-07-19
- Inventor: Wei-Hsuan Lee , Sung-Mao Li , Chien-Yeh Liu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu; Angela D. Murch
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L23/498 ; H01L23/31 ; H01L21/48 ; H01L21/56
Abstract:
A semiconductor package includes a substrate, a set of electrical components, a stud, a tapering electrical interconnection and a package body. The electrical components are disposed on a top surface of the substrate. A bottom surface of the stud is disposed on the top surface of the substrate. A bottom surface of the electrical interconnection is disposed at a top surface of the stud. A width of the stud is greater than or equal to a width of the bottom surface of the electrical interconnection. The package body is disposed on the top surface of the substrate, and encapsulates the electrical components, the stud and a portion of the electrical interconnection. The package body exposes a top surface of the electrical interconnection.
Information query
IPC分类:
