Invention Grant
- Patent Title: Multi-band power amplifier
- Patent Title (中): 多波段功率放大器
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Application No.: US14286791Application Date: 2014-05-23
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Publication No.: US09397614B2Publication Date: 2016-07-19
- Inventor: Saihua Lin , Anup Savla
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Toler Law Group, PC
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H03F1/02 ; H03F3/191 ; H03F3/21 ; H03F3/68 ; H03F3/45 ; H03F1/22 ; H03F3/195 ; H03F3/24
Abstract:
An apparatus includes a first capacitor, an inductor coupled to the first capacitor, and a second capacitor coupled to the inductor. The second capacitor is coupled to a first output of a differential amplifier.
Public/Granted literature
- US20150340991A1 MULTI-BAND POWER AMPLIFIER Public/Granted day:2015-11-26
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