Invention Grant
- Patent Title: Wafer polishing method
- Patent Title (中): 晶圆抛光方法
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Application No.: US14167898Application Date: 2014-01-29
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Publication No.: US09399274B2Publication Date: 2016-07-26
- Inventor: Tetsuji Togawa , Atsushi Yoshida , Toshifumi Watanabe
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2013-015937 20130130
- Main IPC: B24B9/06
- IPC: B24B9/06 ; H01L21/463 ; B24B21/00
Abstract:
An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
Public/Granted literature
- US20140213155A1 WAFER POLISHING APPARATUS AND METHOD Public/Granted day:2014-07-31
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