公开(公告)号：US10811284B2

公开(公告)日：2020-10-20

申请号：US15933237

申请日：2018-03-22

Applicant: EBARA CORPORATION

Inventor： Toshifumi Watanabe ,  Satoru Yamamoto ,  Yu Machida

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/02 ,  B24B37/00 ,  B24B21/00 ,  B24B9/06

Abstract: A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishing a peripheral portion of the substrate by pressing a polishing tape having abrasive grains against the peripheral portion of the substrate with a first head, cleaning the peripheral portion of the substrate by supplying a cleaning liquid to the peripheral portion of the substrate after polishing, bringing a tape having no abrasive grains into contact with the peripheral portion of the substrate after cleaning by a second head, applying light to the tape and receiving reflected light from the tape by a sensor, and judging that the peripheral portion of the substrate is contaminated when an intensity of the received reflected light is lower than a predetermined value.

公开(公告)号：US11648515B2

公开(公告)日：2023-05-16

申请号：US17164026

申请日：2021-02-01

Applicant: EBARA CORPORATION

Inventor： Suguru Ozawa ,  Yuji Araki ,  Yoichi Nakagawa ,  Toshifumi Watanabe

IPC: B01F3/04 ,  B01F23/231 ,  B01F23/40 ,  B01F23/80 ,  B01F25/31 ,  B01F35/60 ,  B01F35/21 ,  B01F35/221 ,  B01F35/71 ,  B01F23/237 ,  B01F101/48

CPC classification number: B01F23/23124 ,  B01F23/49 ,  B01F23/803 ,  B01F25/31 ,  B01F35/2132 ,  B01F35/2213 ,  B01F35/602 ,  B01F35/7176 ,  B01F23/231244 ,  B01F23/237613 ,  B01F23/483 ,  B01F2101/48

Abstract: A gas solution manufacturing device 1 includes a gas supply line 2 configured to supply a gas as a raw material of a gas solution, a liquid supply line 3 configured to supply a liquid as a raw material of the gas solution, a gas solution production unit 4 configured to mix the gas and the liquid together to produce the gas solution, a gas-liquid separation unit 5 configured to perform gas-liquid separation of the produced gas solution into a supplied liquid to be supplied to a use point and a discharged gas to be discharged through an exhaust port, and a gas dissolving unit 6 provided in the liquid supply line 4 and configured to dissolve the discharged gas resulting from the gas-liquid separation in the liquid. The gas dissolving unit 6 is configured with a hollow fiber membrane configured with a gas permeable membrane.

公开(公告)号：US11584669B2

公开(公告)日：2023-02-21

申请号：US16922415

申请日：2020-07-07

Applicant: EBARA CORPORATION

Inventor： Yoichi Nakagawa ,  Suguru Ozawa ,  Yuji Araki ,  Toshifumi Watanabe

IPC: C02F1/78 ,  C02F1/20 ,  B01D19/00 ,  C02F1/00 ,  B01F23/231 ,  C02F103/04 ,  B01F23/237 ,  B01F101/48

Abstract: A gas dissolved liquid manufacturing device includes: a pump configured to pressurize a liquid; a pipe communicating with the pump; a nozzle disposed in the pipe, the nozzle being configured to generate micro bubbles using a supplied gas; and a gas-liquid separation tank whose upper part communicates with the pipe, the gas-liquid separation tank being configured to separate a gas-liquid mixture generated by the nozzle into a gas and a liquid.

公开(公告)号：US12263452B2

公开(公告)日：2025-04-01

申请号：US17488814

申请日：2021-09-29

Applicant: EBARA CORPORATION

Inventor： Suguru Ozawa ,  Yuji Araki ,  Toshifumi Watanabe ,  Yoichi Nakagawa ,  Risa Kimura ,  Tao Xu

IPC: B01F23/00 ,  B01D19/00 ,  B01F23/232 ,  B01F23/70 ,  B01F23/80 ,  B01F25/31 ,  B01F25/51 ,  B01F35/221 ,  B01F35/71 ,  B01F23/237 ,  B01F101/58 ,  H01L21/02

Abstract: A gas solution supply device 1 includes: a first gas-liquid separator 8 in which gas solution is stored; a second gas-liquid separator 16 provided at a stage subsequent to the first gas-liquid separator 8 and in which gas solution to be supplied to a use point is stored; an intermediate line 17 provided between the first gas-liquid separator 8 and the second gas-liquid separator 16; a pressure booster pump 18 provided on the intermediate line 17 and increases a pressure of gas solution being supplied from the first gas-liquid separator 8 to the second gas-liquid separator 16; a gas supply line 2 that supplies gas as a material of the gas solution; and a gas dissolving unit 20 provided on the intermediate line 17 and dissolves the gas supplied from the gas supply line 2 in the gas solution supplied from the first gas-liquid separator 8.

公开(公告)号：US11352274B2

公开(公告)日：2022-06-07

申请号：US16885794

申请日：2020-05-28

Applicant: EBARA CORPORATION

Inventor： Suguru Ozawa ,  Yuji Araki ,  Toshifumi Watanabe ,  Yoichi Nakagawa

IPC: C02F1/78 ,  C02F1/00 ,  C02F103/04

Abstract: A gas dissolution supply apparatus dissolves a gas supplied from a gas supply unit in a liquid supplied from a liquid supply unit to produce a gas dissolution in a gas dissolving unit, stores the gas dissolution produced in the gas dissolving unit in a gas dissolution tank, supplies the gas dissolution from the gas dissolution tank to a point of use, measures the flow rate of a part of the gas dissolution supplied to the point of use that is returned to the gas dissolving unit, and adjusts the flow rate of the liquid supplied from the liquid supply unit to the gas dissolving unit based on the result of the measurement.

公开(公告)号：US09399274B2

公开(公告)日：2016-07-26

申请号：US14167898

申请日：2014-01-29

Applicant: EBARA CORPORATION

Inventor： Tetsuji Togawa ,  Atsushi Yoshida ,  Toshifumi Watanabe

IPC: B24B9/06 ,  H01L21/463 ,  B24B21/00

CPC classification number: B24B9/065 ,  B24B21/002 ,  B24B21/004 ,  B24B21/008 ,  B24B21/06 ,  B24B27/0076 ,  H01L21/02035 ,  H01L21/463

Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

Abstract translation: 描述了抛光衬底的装置和方法。 抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。 相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。 第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。

公开(公告)号：US09604335B2

公开(公告)日：2017-03-28

申请号：US15188638

申请日：2016-06-21

Applicant: EBARA CORPORATION

Inventor： Tetsuji Togawa ,  Atsushi Yoshida ,  Toshifumi Watanabe

IPC: B24B9/06 ,  H01L21/463 ,  B24B21/00 ,  H01L21/02

CPC classification number: B24B9/065 ,  B24B21/002 ,  B24B21/004 ,  B24B21/008 ,  B24B21/06 ,  B24B27/0076 ,  H01L21/02035 ,  H01L21/463

Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.