Invention Grant
- Patent Title: Combined substrate
- Patent Title (中): 组合底物
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Application No.: US14638324Application Date: 2015-03-04
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Publication No.: US09401320B2Publication Date: 2016-07-26
- Inventor: Tomoya Daizo , Takema Adachi , Takeshi Furusawa , Wataru Nakamura , Yuki Ito , Yuki Yoshikawa , Tomoyoshi Hirabayashi
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-044520 20140307
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/10 ; H01L25/00 ; H01L23/00
Abstract:
A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively.
Public/Granted literature
- US20150255433A1 COMBINED SUBSTRATE Public/Granted day:2015-09-10
Information query
IPC分类:
