Invention Grant
- Patent Title: MEMS device and method of manufacturing a MEMS device
- Patent Title (中): MEMS器件和制造MEMS器件的方法
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Application No.: US13651372Application Date: 2012-10-12
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Publication No.: US09402138B2Publication Date: 2016-07-26
- Inventor: Alfons Dehe , Stephan Pindl , Bernhard Knott , Carsten Ahrens
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H04R19/04 ; H04R19/00 ; H04R31/00 ; B81C1/00
Abstract:
A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
Public/Granted literature
- US20140103460A1 MEMS Device and Method of Manufacturing a MEMS Device Public/Granted day:2014-04-17
Information query
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