Invention Grant
- Patent Title: Heat stake joining of adhesively bonded thermoplastic components
- Patent Title (中): 粘合热塑性组分的热桩接合
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Application No.: US13761440Application Date: 2013-02-07
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Publication No.: US09403318B2Publication Date: 2016-08-02
- Inventor: Hesham A. Ezzat , Joseph M. Polewarczyk
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Quinn Law Group, PLLC
- Main IPC: B25G3/34
- IPC: B25G3/34 ; F16B11/00 ; F16B12/04 ; F16L13/00 ; B29C65/30 ; B29C65/18 ; B29C65/52 ; B29C65/72 ; B29C65/00 ; B29C65/48

Abstract:
A method of joining a first thermoplastic component with a second thermoplastic component includes abutting a joint surface of the first thermoplastic component against a joint surface of the second thermoplastic component. The first thermoplastic component includes a thermoplastic protrusion extending from the joint surface, and the joint surface of the second thermoplastic component defines a receiving pocket adapted to receive the thermoplastic protrusion. Abutting a joint surface of the first thermoplastic component against a joint surface of the second thermoplastic component further includes inserting the thermoplastic protrusion into the receiving pocket. Once abutted, thermal energy is applied to a heat-apply surface of the second thermoplastic component, that is opposite the joint surface. The thermal energy is sufficient to melt a portion of the thermoplastic protrusion and a portion of the joint surface of the second thermoplastic component.
Public/Granted literature
- US20140219710A1 HEAT STAKE JOINING OF ADHESIVELY BONDED THERMOPLASTIC COMPONENTS Public/Granted day:2014-08-07
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