Invention Grant
US09405104B2 Split sub-pixel imaging chip with IR-pass filter coating applied on selected sub-pixels
有权
在选定的子像素上应用具有IR通滤波器涂层的分割子像素成像芯片
- Patent Title: Split sub-pixel imaging chip with IR-pass filter coating applied on selected sub-pixels
- Patent Title (中): 在选定的子像素上应用具有IR通滤波器涂层的分割子像素成像芯片
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Application No.: US14041083Application Date: 2013-09-30
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Publication No.: US09405104B2Publication Date: 2016-08-02
- Inventor: Wende Zhang , Jinsong Wang , Kent S. Lybecker , Jeffrey S. Piasecki , Ryan M. Frakes , Travis S. Hester
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee Address: US MI Detroit
- Main IPC: H04N5/33
- IPC: H04N5/33 ; G02B13/14 ; H01L27/146 ; G02B13/18 ; H04N7/18 ; B60R1/00 ; H04N9/00 ; H04N5/355 ; G02B19/00 ; G02B5/20
Abstract:
An apparatus for capturing an image includes a plurality of lens elements coaxially encompassed within a lens housing. A split-sub-pixel imaging chip includes an IR-pass filter coating applied on selected sub-pixels. The sub-pixels include a long exposure sub-pixel and a short-exposure sub-pixel for each of a plurality of green blue and red pixels.
Public/Granted literature
- US20140176724A1 SPLIT SUB-PIXEL IMAGING CHIP WITH IR-PASS FILTER COATING APPLIED ON SELECTED SUB-PIXELS Public/Granted day:2014-06-26
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