Invention Grant
- Patent Title: Temperature management circuit, system on chip including the same and method of managing temperature
- Patent Title (中): 温度管理电路,系统芯片包括相同的温度管理方法
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Application No.: US13656383Application Date: 2012-10-19
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Publication No.: US09405337B2Publication Date: 2016-08-02
- Inventor: Ji Hyung Kim , Sang Wook Park , Chong Kun Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2012-0001139 20120104
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G06F1/20 ; G05D23/19 ; H01L23/34

Abstract:
In managing temperature in a system on chip (SOC), a main temperature signal is generated using a main sensor, where the main temperature signal is a signal having a value corresponding to a main temperature of the SOC. Subsidiary temperature signals are generated using subsidiary sensors, where the subsidiary temperature signals are pulse signals having frequencies corresponding to subsidiary temperatures of subsidiary blocks in the SOC, respectively. An operation of the SOC is controlled based upon the main temperature signal and the subsidiary temperature signals.
Public/Granted literature
- US20130169347A1 Temperature Management Circuit, System on Chip Including the Same and Method of Managing Temperature Public/Granted day:2013-07-04
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