发明授权
- 专利标题: Package structure and method of forming the same
- 专利标题(中): 包装结构及其形成方法
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申请号: US14711864申请日: 2015-05-14
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公开(公告)号: US09406634B2公开(公告)日: 2016-08-02
- 发明人: Yuh Chern Shieh , Han-Ping Pu , Yu-Feng Chen , Tin-Hao Kuo
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW
- 代理机构: Hauptman Ham, LLP
- 主分类号: H01L23/488
- IPC分类号: H01L23/488 ; H01L23/00 ; H01L23/498
摘要:
A package includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis, wherein the first work piece is rigid, and an entirety of the metal trace is on the first work piece. The package further includes a second work piece with a plurality of elongated bumps, wherein at least one of the plurality of elongated metal bumps has a second axis and at least another of the plurality of elongated metal bumps has a third axis, wherein the second and the third axes are not the same and the second axis is at a non-zero angle from the first axis, wherein the plurality of elongated bumps are electrically connected to the metal trace.
公开/授权文献
- US20150243622A1 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME 公开/授权日:2015-08-27
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