发明授权
- 专利标题: Ion implantation method and ion implantation apparatus
- 专利标题(中): 离子注入法和离子注入装置
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申请号: US14696060申请日: 2015-04-24
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公开(公告)号: US09412561B2公开(公告)日: 2016-08-09
- 发明人: Takeshi Kurose , Noriyasu Ido , Hiroyuki Kariya
- 申请人: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- 当前专利权人: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Michael Best & Friedrich LLP
- 优先权: JP2014-091762 20140425
- 主分类号: G01R31/26
- IPC分类号: G01R31/26 ; H01J37/304 ; H01J37/30 ; H01J37/317
摘要:
An ion implantation apparatus includes a beam scanner, a beam measurement unit that is able to measure an ion irradiation amount distribution in a beam scanning direction at a wafer position, and a control unit that outputs a control waveform to the beam scanner for scanning an ion beam. The control unit includes an output unit that outputs a reference control waveform to the beam scanner, an acquisition unit that acquires the ion irradiation amount distribution measured for the ion beam scanned based on the reference control waveform from a beam measurement unit, and a generation unit that generates a correction control waveform by using the acquired ion irradiation amount distribution. The control unit outputs the correction control waveform so that the ion irradiation amount distribution becomes a target distribution and the ion irradiation amount distribution per unit time becomes a target value.
公开/授权文献
- US20150311077A1 ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS 公开/授权日:2015-10-29
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