Invention Grant
- Patent Title: Lead for connection to a semiconductor device
- Patent Title (中): 用于连接到半导体器件的引线
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Application No.: US14667979Application Date: 2015-03-25
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Publication No.: US09418918B2Publication Date: 2016-08-16
- Inventor: Roelf Anco Jacob Groenhuis , Tim Boettcher
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP14163714 20140407
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00
Abstract:
There is disclosed a lead for connection to a semiconductor device die, the lead comprising a clip portion. The clip portion comprises a major surface having two or more protrusions extending therefrom for connection to a bond pad of the semiconductor device die.
Public/Granted literature
- US20150287666A1 LEAD FOR CONNECTION TO A SEMICONDUCTOR DEVICE Public/Granted day:2015-10-08
Information query
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