公开(公告)号：US09704823B2

公开(公告)日：2017-07-11

申请号：US14927283

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis ,  Leonardus Antonius Elisabeth van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683 ,  H01L23/544

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

公开(公告)号：US20160005679A1

公开(公告)日：2016-01-07

申请号：US14322419

申请日：2014-07-02

Applicant: NXP B.V.

Inventor： Emil Casey Israel ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/304 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L21/683

CPC classification number: H01L21/304 ,  H01L21/561 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18165 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/20752 ,  H01L2224/85 ,  H01L2924/206

Abstract: Consistent with an example embodiment, there is a method for packaging an integrated circuit (IC) device. The method comprises attaching a lead frame to the carrier tape; the lead frame has an array of device positions on the carrier tape and pad landings surround the device positions for making electrical connections to the plurality of active device die. A plurality of active device die are mounted on the carrier tape within the array of device positions; each said active device die has bond pads, each of said active device die has been subjected to back-grinding to a prescribed thickness and has a solderable conductive surface on its underside. On the bond pads, the plurality of active devices are wire bonded to the pad landings on the lead frame. The lead frame and wire bonded active devices are encapsulated, leaving the solderable die backside and lead frame backside exposed.

Abstract translation: 与示例性实施例一致，存在用于封装集成电路（IC）设备的方法。 该方法包括将引线框架附接到载带上; 引线框架具有载体带上的器件位置阵列，并且围绕着用于与多个有源器件管芯电连接的器件位置的焊盘接地。 多个有源器件管芯安装在器件位置阵列内的载体带上; 每个所述有源器件管芯具有接合焊盘，所述有源器件管芯中的每一个已经经过后研磨至规定厚度，并且在其下侧具有可焊接的导电表面。 在接合焊盘上，多个有源器件被引线接合到引线框架上的焊盘平台上。 引线框架和引线键合有源器件被封装，留下可焊接模具背面和引线框架背面暴露。

公开(公告)号：US20170179076A1

公开(公告)日：2017-06-22

申请号：US15450972

申请日：2017-03-06

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56 ,  H01L23/544 ,  H01L21/304

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

公开(公告)号：US20160276176A1

公开(公告)日：2016-09-22

申请号：US14927283

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis ,  Leonardus Antonius Elisabeth van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US10315821B2

公开(公告)日：2019-06-11

申请号：US15352214

申请日：2016-11-15

Applicant: NXP B.V.

Inventor： Jeroen Johannes Maria Zaal ,  Roelf Anco Jacob Groenhuis ,  Leo van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx

IPC: B65D73/02 ,  H01L21/683 ,  H01L23/06 ,  H01L23/053

Abstract: One example discloses a component carrier, including: a cavity; wherein the cavity includes a set of cavity registration features configured to engage with a set of component registration features on a component; and wherein the cavity registration features are within the cavity.

公开(公告)号：US09842776B2

公开(公告)日：2017-12-12

申请号：US14994590

申请日：2016-01-13

Applicant: NXP B.V.

Inventor： John Suman Nakka ,  Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis

IPC: H01L21/78 ,  H01L21/02 ,  H01L23/31 ,  H01L21/304 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L21/78 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/11

Abstract: Integrated circuit dies within a semiconductor wafer are separated using an approach that may facilitate mitigation of warpage, cracking and other undesirable aspects. As may be implemented in accordance with one or more embodiments, a semiconductor wafer is provided with a plurality of integrated circuit dies and first and second opposing surfaces, and with the second surface of the wafer being ground. A first mold compound is applied to the ground second surface, and the integrated circuit dies are separated along saw lanes while using the first mold compound to hold the dies in place. The integrated circuit dies are encapsulated with the mold compounds, by applying the second mold compound to the first surface and along sidewalls of the integrated circuit dies.

公开(公告)号：US20170200646A1

公开(公告)日：2017-07-13

申请号：US14994590

申请日：2016-01-13

Applicant: NXP B.V.

Inventor： John Suman Nakka ,  Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis

IPC: H01L21/78 ,  H01L21/56 ,  H01L23/544 ,  H01L23/31 ,  H01L23/00 ,  H01L21/304 ,  H01L21/683

CPC classification number: H01L21/78 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/11

Abstract: Integrated circuit dies within a semiconductor wafer are separated using an approach that may facilitate mitigation of warpage, cracking and other undesirable aspects. As may be implemented in accordance with one or more embodiments, a semiconductor wafer is provided with a plurality of integrated circuit dies and first and second opposing surfaces, and with the second surface of the wafer being ground. A first mold compound is applied to the ground second surface, and the integrated circuit dies are separated along saw lanes while using the first mold compound to hold the dies in place. The integrated circuit dies are encapsulated with the mold compounds, by applying the second mold compound to the first surface and along sidewalls of the integrated circuit dies.

公开(公告)号：US09222989B2

公开(公告)日：2015-12-29

申请号：US14156296

申请日：2014-01-15

Applicant: NXP B.V.

Inventor： Paulus Martinus Catharina Hesen ,  Roelf Anco Jacob Groenhuis ,  Johannes Wilhelmus Dorotheus Bosch

IPC: G01R33/00 ,  G01R33/09 ,  H01L21/56 ,  H01L23/00

CPC classification number: G01R33/0052 ,  G01R33/09 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/14 ,  H01L2924/30107 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A sensor package includes a lead frame with a first portion extending and a second portion extending in a direction inclined with respect to the first potion. The sensor package also includes an application specific integrated circuit and a magneto resistive sensor and a ferrite provided with a molding body.

Abstract translation: 传感器封装包括具有第一部分延伸的引线框架和在相对于第一部分倾斜的方向上延伸的第二部分。 传感器封装还包括专用集成电路和磁阻传感器以及设置有成型体的铁氧体。

公开(公告)号：US08981566B2

公开(公告)日：2015-03-17

申请号：US13890055

申请日：2013-05-08

Applicant: NXP B.V.

Inventor： Tim Boettcher ,  Sven Walczyk ,  Roelf Anco Jacob Groenhuis ,  Rolf Brenner ,  Emiel De Bruin

IPC: H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L21/78 ,  H01L21/56 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/05016 ,  H01L2224/05088 ,  H01L2224/051 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/06181 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/20 ,  H01L2224/291 ,  H01L2224/32105 ,  H01L2224/32113 ,  H01L2224/32237 ,  H01L2224/33181 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2224/05552

Abstract: Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.

Abstract translation: 公开了一种分立半导体器件封装（100），包括半导体管芯（110），其具有第一表面和与所述第一表面相对的第二表面，所述第二表面承载触点（112）; 所述接触件上的导电体（120）; 横向封装所述导电体的封装材料（130） 以及与焊料帽导电接触的诸如焊料帽，另外的半导体管芯或其组合的封盖构件（140,610），所述焊帽覆盖在封装材料上。 可以在第一表面上设置另外的焊锡帽（150）。 还公开了制造这种分立半导体器件封装的方法。

公开(公告)号：US10177111B2

公开(公告)日：2019-01-08

申请号：US15450972

申请日：2017-03-06

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683 ,  H01L23/544 ,  H01L21/304

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.