Invention Grant
- Patent Title: Component supplying apparatus and component supplying method
- Patent Title (中): 零部件供给装置及部件供给方法
-
Application No.: US14388409Application Date: 2013-09-03
-
Publication No.: US09420736B2Publication Date: 2016-08-16
- Inventor: Minoru Kitani , Kazunori Kanai , Kazuo Kido , Seikou Abe
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-027385 20130215
- International Application: PCT/JP2013/005198 WO 20130903
- International Announcement: WO2014/125528 WO 20140821
- Main IPC: H05K13/02
- IPC: H05K13/02 ; B32B43/00 ; H05K13/04

Abstract:
A component supplying apparatus includes a main tape entering port, a component supply port through which components are picked up from a carrier tape, a main tape path extending in a body part from the main tape entering port to the underside of the component supply port, a top tape removing part removing the top tape from the carrier tape on the main tape path upstream of the component supply port, a sub tape entering port, a sub tape path meeting a slope path portion of the main tape path at a meeting point upstream of the top tape removing part, and at least one sprocket wheels engaging with the carrier tape on the main tape path downstream of the meeting point. A length of the sub tape path is shorter than a length of the main tape path from the main tape entering port to the meeting point.
Public/Granted literature
- US20150053353A1 COMPONENT SUPPLYING APPARATUS AND COMPONENT SUPPLYING METHOD Public/Granted day:2015-02-26
Information query