Invention Grant
- Patent Title: Heat treatment apparatus
- Patent Title (中): 热处理设备
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Application No.: US13922450Application Date: 2013-06-20
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Publication No.: US09425074B2Publication Date: 2016-08-23
- Inventor: Shinji Asari , Hidekazu Sato , Tomohiro Shiobara
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2012-138510 20120620
- Main IPC: F26B19/00
- IPC: F26B19/00 ; H01L21/67

Abstract:
A heat treatment apparatus performs a heat treatment on a plurality of target objects held by a holding unit while allowing an inert gas to flow upwardly in a vertical processing container with at least one heating unit provided in the vicinity of the processing container. The heat treatment apparatus includes: a main temperature control unit configured to control the heating unit; an inert gas passage through which the inert gas flows into the processing container; an inert gas heating unit installed in the inert gas passage and configured to heat the inert gas; a first temperature measuring unit installed in the inert gas heating unit; and a temperature controller configured to control the inert gas heating unit based on temperatures measured by the first temperature measuring unit.
Public/Granted literature
- US20140373387A1 HEAT TREATMENT APPARATUS Public/Granted day:2014-12-25
Information query
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