Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14486089Application Date: 2014-09-15
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Publication No.: US09425217B2Publication Date: 2016-08-23
- Inventor: Noritaka Ishihara , Masashi Oota , Masashi Tsubuku , Masami Jintyou , Yukinori Shima , Junichi Koezuka , Yasuharu Hosaka , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2013-196333 20130923
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L27/12 ; H01L29/45 ; H01L29/417 ; H01L29/786

Abstract:
Defects in an oxide semiconductor film are reduced in a semiconductor device including the oxide semiconductor film. The electrical characteristics of a semiconductor device including an oxide semiconductor film are improved. The reliability of a semiconductor device including an oxide semiconductor film is improved. A semiconductor device including an oxide semiconductor layer; a metal oxide layer in contact with the oxide semiconductor layer, the metal oxide layer including an In-M oxide (M is Ti, Ga, Y, Zr, La, Ce, Nd, or Hf); and a conductive layer in contact with the metal oxide layer, the conductive layer including copper, aluminum, gold, or silver is provided. In the semiconductor device, y/(x+y) is greater than or equal to 0.75 and less than 1 where the atomic ratio of In to M included in the metal oxide layer is In:M=x:y.
Public/Granted literature
- US20150084043A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-03-26
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