Invention Grant
- Patent Title: Wafer-scale package including power source
- Patent Title (中): 晶圆级封装，包括电源
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Application No.: US15079957Application Date: 2016-03-24
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Publication No.: US09431312B2Publication Date: 2016-08-30
- Inventor: Richard J O'Brien , John K Day , Paul F Gerrish , Michael F Mattes , David A Ruben , Malcolm K Grief
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Evans M. Mburu; Stephen W. Bauer
- Main IPC: H01L23/12
- IPC: H01L23/12 ; A61N1/375
Abstract:
A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
Public/Granted literature
- US20160204004A1 WAFER-SCALE PACKAGE INCLUDING POWER SOURCE Public/Granted day:2016-07-14
Information query
IPC分类:
