Invention Grant
- Patent Title: Wiring board and method for manufacturing the same
- Patent Title (中): 接线板及其制造方法
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Application No.: US14294534Application Date: 2014-06-03
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Publication No.: US09431347B2Publication Date: 2016-08-30
- Inventor: Masatoshi Kunieda , Makoto Terui , Asuka Il , Yoshinori Shizuno
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-118884 20130605
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01L23/538 ; H01L21/48 ; H01L23/498 ; H01L23/00 ; H01L25/065 ; H01L25/18
Abstract:
A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads.
Public/Granted literature
- US20140360759A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-12-11
Information query
