PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE
    2.
    发明申请
    PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE 有权
    印刷线路板,其制造方法和半导体器件

    公开(公告)号:US20160066422A1

    公开(公告)日:2016-03-03

    申请号:US14840693

    申请日:2015-08-31

    Abstract: A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.

    Abstract translation: 印刷电路板包括第一树脂绝缘层,包括形成在第一树脂绝缘层上的第一安装焊盘的第一导体图案和位于第一树脂绝缘层上的布线结构,并且包括第二树脂绝缘层和第二导体图案 使得第二树脂绝缘层和第二导体图案位于第一导体图案附近,并且第二导体图案包括第二安装垫。 第二安装焊盘嵌入在第二树脂绝缘层中,使得第二安装焊盘具有暴露在第二树脂绝缘层的暴露表面上的安装表面,并且第一安装焊盘具有安装表面,使得第一和 第二安装焊盘形成在同一平面上。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    接线板及其制造方法

    公开(公告)号:US20140102768A1

    公开(公告)日:2014-04-17

    申请号:US14053854

    申请日:2013-10-15

    Abstract: A wiring board includes a first insulation layer, a first conductive pattern structure formed on the first insulation layer, a wiring structure formed on the first insulation layer and including a second insulation layer and a second conductive pattern structure on the second insulation layer, and a third insulation layer formed on the first insulation layer and the first conductive pattern structure and having first and second openings such that the first opening is exposing at least a portion of a surface of the wiring structure and the second opening is exposing at least a portion of the first conductive pattern structure. The wiring structure includes a third conductive pattern structure forming an outermost layer of the wiring structure and including a mounting pad structure which mounts a semiconductor device. The first opening is formed such that the first opening is exposing pad formation area of the mounting pad structure.

    Abstract translation: 布线基板包括第一绝缘层,形成在第一绝缘层上的第一导电图形结构,形成在第一绝缘层上的布线结构,并且在第二绝缘层上包括第二绝缘层和第二导电图案结构, 第三绝缘层,形成在第一绝缘层和第一导电图案结构上,并且具有第一和第二开口,使得第一开口暴露出布线结构的表面的至少一部分,并且第二开口暴露出至少一部分 第一导电图案结构。 布线结构包括形成布线结构的最外层的第三导电图案结构,并且包括安装半导体器件的安装焊盘结构。 第一开口形成为使得第一开口暴露安装垫结构的焊盘形成区域。

    Wiring board with built-in electronic component and method for manufacturing the same

    公开(公告)号:US09723728B2

    公开(公告)日:2017-08-01

    申请号:US14817388

    申请日:2015-08-04

    Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.

    Wiring board and method for manufacturing the same
    10.
    发明授权
    Wiring board and method for manufacturing the same 有权
    接线板及其制造方法

    公开(公告)号:US09565756B2

    公开(公告)日:2017-02-07

    申请号:US13853338

    申请日:2013-03-29

    Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive patterns and having an opening portion, a wiring structure accommodated in the opening portion of the second insulation layer and including an insulation layer and conductive patterns on the insulation layer, second conductive patterns formed on the second insulation layer; and a via conductor formed in the second insulation layer and connecting one of the first conductive patterns and one of the second conductive patterns.

    Abstract translation: 布线板包括第一绝缘层,形成在第一绝缘层上的第一导电图案,形成在第一绝缘层上的第二绝缘层和第一导电图案,并具有开口部分,布置结构容纳在第一绝缘层的开口部分中 第二绝缘层,并且在绝缘层上包括绝缘层和导电图案,形成在第二绝缘层上的第二导电图案; 以及形成在所述第二绝缘层中并连接所述第一导电图案中的一个和所述第二导电图案中的一个的通孔导体。

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