Invention Grant
- Patent Title: Array substrate, method for manufacturing the same, display device
- Patent Title (中): 阵列基板及其制造方法,显示装置
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Application No.: US14418161Application Date: 2014-04-30
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Publication No.: US09431432B2Publication Date: 2016-08-30
- Inventor: Hyun Sic Choi , Hee Cheol Kim
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201310717853 20131223
- International Application: PCT/CN2014/076608 WO 20140430
- International Announcement: WO2015/096340 WO 20150702
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/56 ; H01L21/768 ; H01L23/538

Abstract:
The embodiments of the present invention disclose an array substrate, a method for manufacturing the same, and a display device. With the solutions of the embodiments, aperture rate is increased, and gate signal delay caused by increased connection resistance of gate line is alleviated. The array substrate of the present invention includes a thin film transistor; a substrate; a common electrode provided on the substrate; a gate line comprising a plurality of separate segments arranged to be spaced apart from each other and connected with each other through a bridge; and a common electrode line provided to be spaced apart from the gate line, the gate line and the common electrode line being in the same layer, wherein the common electrode line comprises a connection segment extending through a gap between separate segments to electrically connect with the common electrode directly.
Public/Granted literature
- US20160005766A1 ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE Public/Granted day:2016-01-07
Information query
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