Invention Grant
- Patent Title: Grounding scheme for modular embedded multilevel converter
- Patent Title (中): 模块化嵌入式多电平转换器的接地方案
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Application No.: US13953153Application Date: 2013-07-29
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Publication No.: US09431918B2Publication Date: 2016-08-30
- Inventor: Di Zhang , Luis José Garcés Rivera , Ravisekhar Nadimpalli Raju , Rixin Lai , Andrew Allen Rockhill
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Nitin N. Joshi
- Main IPC: H02M7/5387
- IPC: H02M7/5387 ; H02M7/217 ; H02M7/757 ; H02M7/487 ; H02M7/483

Abstract:
A power converter includes at least one leg with a first string including a plurality of controllable semiconductor switches, a first connecting node, and a second connecting node, wherein the first string is operatively coupled across a first bus and a second bus. The at least one leg also includes a second string operatively coupled to the first string via the first connecting node and the second connecting node, wherein the second string includes a plurality of switching units. The first string includes a first branch and a second branch, wherein the second branch is operatively coupled to the first branch via a third connecting node and the third connecting node is coupled to a ground connection.
Public/Granted literature
- US20140092660A1 MULTILEVEL CONVERTER SYSTEM Public/Granted day:2014-04-03
Information query
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