Invention Grant
- Patent Title: Customizing connections of conductors of a printed circuit board
- Patent Title (中): 定制印刷电路板导体的连接
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Application No.: US14918620Application Date: 2015-10-21
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Publication No.: US09433091B1Publication Date: 2016-08-30
- Inventor: Andreas C. Doering
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Ellenbogen & Kammer, LLP
- Agent Daniel P. Morris, Esq.
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09 ; H05K1/16 ; H05K7/00 ; H01K3/10 ; H05K1/02 ; H05K1/11 ; H05K3/40 ; H05K3/10 ; H05K3/46

Abstract:
A method is provided for customizing connections of conductors of a printed circuit board (PCB) including conductors and a cavity formed in a thickness of the PCB, and adjoining two of the conductors. The cavity includes two distinct electrical contacts, each in electrical communication with one of the two conductors. The cavity is at least partly filled with an electrically conductive material to enable electrical communication between the two conductors. The cavity is preferably a buried cavity, joined by one or more ducts, such that the electrically conductive material can be injected into the cavity via the duct. One, or each, of the two conductors is an inner conductor of the PCB. The injected conductive material may be a liquid or a gel; and is preferably a conductive adhesive. The present invention further concerns a PCB as obtained from the above method.
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