Invention Grant
- Patent Title: Light detection device having a semiconductor light detection element, a mounting substrate, a glass substrate and a plurality of through-hole electrodes electrically connected to quenching resistors
- Patent Title (中): 具有半导体光检测元件,安装基板,玻璃基板以及电连接到淬火电阻器的多个通孔电极的光检测装置
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Application No.: US14352429Application Date: 2012-08-02
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Publication No.: US09435686B2Publication Date: 2016-09-06
- Inventor: Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
- Applicant: Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2011-232106 20111021
- International Application: PCT/JP2012/069730 WO 20120802
- International Announcement: WO2013/058003 WO 20130425
- Main IPC: G01J1/42
- IPC: G01J1/42 ; H01L27/144 ; H01L31/107 ; H01L27/146 ; G01T1/208 ; H01L31/0224

Abstract:
A semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in a semiconductor substrate, quenching resistors connected in series to the respective avalanche photodiodes and arranged on a first principal surface side of the semiconductor substrate, and a plurality of through-hole electrodes electrically connected to the quenching resistors and formed so as to penetrate the semiconductor substrate from the first principal surface side to a second principal surface side. A mounting substrate includes a plurality of electrodes arranged corresponding to the respective through-hole electrodes on a third principal surface side. The through-hole electrodes and the electrodes are electrically connected through bump electrodes, and a side surface of the semiconductor substrate and a side surface of a glass substrate are flush with each other.
Public/Granted literature
- US20140263975A1 LIGHT DETECTION DEVICE Public/Granted day:2014-09-18
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