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1.发明授权Light detection device having a semiconductor light detection element and a mounting substrate with quenching circuits 有权具有半导体光检测元件的光检测装置和具有淬火电路的安装基板公开(公告)号：US09368528B2
公开(公告)日：2016-06-14
申请号：US14350647
申请日：2012-08-02
IPC分类号： H01L27/144 , H01L31/107 , H01L27/146
CPC分类号： H01L27/14643 , H01L27/1446 , H01L27/14618 , H01L27/14636 , H01L27/14658 , H01L31/107
摘要： A light detection device 1 has a semiconductor light detection element having a semiconductor substrate, and a mounting substrate arranged as opposed to the semiconductor light detection element. The semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in the semiconductor substrate, and electrodes electrically connected to the respective avalanche photodiodes and arranged on a second principal surface side of the semiconductor substrate. The mounting substrate includes a plurality of electrodes arranged corresponding to the respective electrodes on a third principal surface side, and quenching resistors electrically connected to the respective electrodes and arranged on the third principal surface side. The electrodes and the electrodes are connected through bump electrodes.
摘要翻译： 光检测装置1具有半导体光检测元件，该半导体光检测元件具有半导体衬底和与半导体光检测元件相对布置的安装衬底。 半导体光检测元件包括以Geiger模式操作并形成在半导体衬底中的多个雪崩光电二极管，以及电连接到各个雪崩光电二极管并且布置在半导体衬底的第二主表面侧上的电极。 安装基板包括在第三主面侧对应于各个电极布置的多个电极，并且电连接到各个电极并且布置在第三主表面侧上的淬火电阻。 电极和电极通过凸块电极连接。
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公开(公告)号：US20140327100A1
公开(公告)日：2014-11-06
申请号：US14352398
申请日：2012-08-02
IPC分类号： H01L27/146
CPC分类号： H01L27/1446 , H01L27/1443 , H01L27/14605 , H01L28/20 , H01L31/02005 , H01L31/02322 , H01L31/107 , H01L2224/11
摘要： A semiconductor light detection element has a plurality of channels, each of which consists of a photodiode array including a plurality of avalanche photodiodes operating in Geiger mode, quenching resistors connected in series to the respective avalanche photodiodes, and signal lines to which the quenching resistors are connected in parallel. A mounting substrate is configured so that a plurality of electrodes corresponding to the respective channels are arranged on a third principal surface side and so that a signal processing unit for processing output signals from the respective channels is arranged on a fourth principal surface side. In a semiconductor substrate, through-hole electrodes electrically connected to the signal lines are formed for the respective channels. The through-hole electrodes and the electrodes are electrically connected through bump electrodes.
摘要翻译： 半导体光检测元件具有多个通道，每个通道由包括以盖革模式操作的多个雪崩光电二极管的光电二极管阵列组成，与各雪崩光电二极管串联连接的淬火电阻器，以及淬灭电阻器 并联连接 安装基板被配置为使得与第三主面对应的多个电极布置在第三主表面上，并且使得用于处理来自各个通道的输出信号的信号处理单元被布置在第四主表面侧。 在半导体基板中，形成与各信道电连接的信号线的通孔电极。 通孔电极和电极通过凸块电极电连接。
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公开(公告)号：US20140263975A1
公开(公告)日：2014-09-18
申请号：US14352429
申请日：2012-08-02
IPC分类号： G01J1/42 , H01L27/144
CPC分类号： H01L31/107 , G01J1/42 , G01T1/208 , H01L27/144 , H01L27/1443 , H01L27/14636 , H01L27/14643 , H01L27/14658 , H01L27/14663 , H01L28/20 , H01L31/02005 , H01L31/022408
摘要： A semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in a semiconductor substrate, quenching resistors connected in series to the respective avalanche photodiodes and arranged on a first principal surface side of the semiconductor substrate, and a plurality of through-hole electrodes electrically connected to the quenching resistors and formed so as to penetrate the semiconductor substrate from the first principal surface side to a second principal surface side. A mounting substrate includes a plurality of electrodes arranged corresponding to the respective through-hole electrodes on a third principal surface side. The through-hole electrodes and the electrodes are electrically connected through bump electrodes, and a side surface of the semiconductor substrate and a side surface of a glass substrate are flush with each other.
摘要翻译： 半导体光检测元件包括以Geiger模式操作并形成在半导体衬底中的多个雪崩光电二极管，与各个雪崩光电二极管串联连接并设置在半导体衬底的第一主表面侧上的骤冷电阻器，以及多个通孔 电极连接到淬火电阻器并形成为从第一主表面侧穿过半导体衬底到第二主表面侧的电极。 安装基板包括在第三主表面侧对应于相应的通孔电极布置的多个电极。 通孔电极和电极通过凸块电极电连接，半导体衬底的侧表面和玻璃衬底的侧表面彼此齐平。
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公开(公告)号：US08969990B2
公开(公告)日：2015-03-03
申请号：US14352398
申请日：2012-08-02
IPC分类号： H01L31/107 , H01L27/146
CPC分类号： H01L27/1446 , H01L27/1443 , H01L27/14605 , H01L28/20 , H01L31/02005 , H01L31/02322 , H01L31/107 , H01L2224/11
摘要： A semiconductor light detection element has a plurality of channels, each of which consists of a photodiode array including a plurality of avalanche photodiodes operating in Geiger mode, quenching resistors connected in series to the respective avalanche photodiodes, and signal lines to which the quenching resistors are connected in parallel. A mounting substrate is configured so that a plurality of electrodes corresponding to the respective channels are arranged on a third principal surface side and so that a signal processing unit for processing output signals from the respective channels is arranged on a fourth principal surface side. In a semiconductor substrate, through-hole electrodes electrically connected to the signal lines are formed for the respective channels. The through-hole electrodes and the electrodes are electrically connected through bump electrodes.
摘要翻译： 半导体光检测元件具有多个通道，每个通道由包括以盖革模式操作的多个雪崩光电二极管的光电二极管阵列组成，与各雪崩光电二极管串联连接的淬火电阻器，以及淬灭电阻器 并联连接 安装基板被配置为使得与第三主面对应的多个电极布置在第三主表面上，并且使得用于处理来自各个通道的输出信号的信号处理单元被布置在第四主表面侧。 在半导体基板中，形成与各信道电连接的信号线的通孔电极。 通孔电极和电极通过凸块电极电连接。
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公开(公告)号：US20140291486A1
公开(公告)日：2014-10-02
申请号：US14350647
申请日：2012-08-02
IPC分类号： H01L27/144
CPC分类号： H01L27/14643 , H01L27/1446 , H01L27/14618 , H01L27/14636 , H01L27/14658 , H01L31/107
摘要： A light detection device 1 has a semiconductor light detection element having a semiconductor substrate, and a mounting substrate arranged as opposed to the semiconductor light detection element. The semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in the semiconductor substrate, and electrodes electrically connected to the respective avalanche photodiodes and arranged on a second principal surface side of the semiconductor substrate. The mounting substrate includes a plurality of electrodes arranged corresponding to the respective electrodes on a third principal surface side, and quenching resistors electrically connected to the respective electrodes and arranged on the third principal surface side. The electrodes and the electrodes are connected through bump electrodes.
摘要翻译： 光检测装置1具有半导体光检测元件，该半导体光检测元件具有半导体衬底和与半导体光检测元件相对布置的安装衬底。 半导体光检测元件包括以Geiger模式操作并形成在半导体衬底中的多个雪崩光电二极管，以及电连接到各个雪崩光电二极管并且布置在半导体衬底的第二主表面侧上的电极。 安装基板包括在第三主面侧对应于各个电极布置的多个电极，并且电连接到各个电极并且布置在第三主表面侧上的淬火电阻。 电极和电极通过凸块电极连接。
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6.发明授权公开(公告)号：US09435686B2
公开(公告)日：2016-09-06
申请号：US14352429
申请日：2012-08-02
IPC分类号： G01J1/42 , H01L27/144 , H01L31/107 , H01L27/146 , G01T1/208 , H01L31/0224
CPC分类号： H01L31/107 , G01J1/42 , G01T1/208 , H01L27/144 , H01L27/1443 , H01L27/14636 , H01L27/14643 , H01L27/14658 , H01L27/14663 , H01L28/20 , H01L31/02005 , H01L31/022408
摘要： A semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in a semiconductor substrate, quenching resistors connected in series to the respective avalanche photodiodes and arranged on a first principal surface side of the semiconductor substrate, and a plurality of through-hole electrodes electrically connected to the quenching resistors and formed so as to penetrate the semiconductor substrate from the first principal surface side to a second principal surface side. A mounting substrate includes a plurality of electrodes arranged corresponding to the respective through-hole electrodes on a third principal surface side. The through-hole electrodes and the electrodes are electrically connected through bump electrodes, and a side surface of the semiconductor substrate and a side surface of a glass substrate are flush with each other.
摘要翻译： 半导体光检测元件包括以Geiger模式操作并形成在半导体衬底中的多个雪崩光电二极管，与各个雪崩光电二极管串联连接并设置在半导体衬底的第一主表面侧上的骤冷电阻器，以及多个通孔 电极连接到淬火电阻器并形成为从第一主表面侧穿过半导体衬底到第二主表面侧的电极。 安装基板包括在第三主表面侧对应于相应的通孔电极布置的多个电极。 通孔电极和电极通过凸块电极电连接，半导体衬底的侧表面和玻璃衬底的侧表面彼此齐平。
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公开(公告)号：US20110266644A1
公开(公告)日：2011-11-03
申请号：US13143765
申请日：2010-02-09
申请人： Kazuhisa Yamamura , Akira Sakamoto , Terumasa Nagano , Yasuhito Miyazaki , Yasuhito Yoneta , Hisanori Suzuki , Masaharu Muramatsu
发明人： Kazuhisa Yamamura , Akira Sakamoto , Terumasa Nagano , Yasuhito Miyazaki , Yasuhito Yoneta , Hisanori Suzuki , Masaharu Muramatsu
IPC分类号： H01L31/02
CPC分类号： H01L31/0236 , H01L27/1462 , H01L27/1464 , H01L31/02327 , H01L31/035281 , H01L31/103 , Y02E10/50
摘要： A semiconductor photodetection element SP has a silicon substrate 21 comprised of a semiconductor of a first conductivity type, having a first principal surface 21a and a second principal surface 21b opposed to each other, and having a semiconductor layer 23 of a second conductivity type formed on the first principal surface 21a side; and charge transfer electrodes 25 provided on the first principal surface 21a and adapted to transfer generated charge. In the silicon substrate 21, an accumulation layer 31 of the first conductivity type having a higher impurity concentration than the silicon substrate 21 is formed on the second principal surface 21b side and an irregular asperity 10 is formed in a region opposed to at least the semiconductor region 23, in the second principal surface 21b. The region where the irregular asperity 10 is formed in the second principal surface 21b of the silicon substrate 21 is optically exposed.
摘要翻译： 半导体光检测元件SP具有由第一导电类型的半导体构成的硅基板21，第一导电类型的半导体具有彼此相对的第一主表面21a和第二主表面21b，并且具有第二导电类型的半导体层23形成在 第一主表面21a侧; 以及设置在第一主表面21a上并适于传送产生的电荷的电荷转移电极25。 在硅基板21中，在第二主面21b侧形成有比硅基板21高的杂质浓度的第一导电类型的累积层31，并且在与至少半导体相对的区域中形成不规则的凹凸10 区域23，在第二主表面21b中。 在硅衬底21的第二主表面21b中形成不规则凹凸10的区域被光学曝光。
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公开(公告)号：US08629485B2
公开(公告)日：2014-01-14
申请号：US13143765
申请日：2010-02-09
申请人： Kazuhisa Yamamura , Akira Sakamoto , Terumasa Nagano , Yasuhito Miyazaki , Yasuhito Yoneta , Hisanori Suzuki , Masaharu Muramatsu
发明人： Kazuhisa Yamamura , Akira Sakamoto , Terumasa Nagano , Yasuhito Miyazaki , Yasuhito Yoneta , Hisanori Suzuki , Masaharu Muramatsu
IPC分类号： H01L31/062
CPC分类号： H01L31/0236 , H01L27/1462 , H01L27/1464 , H01L31/02327 , H01L31/035281 , H01L31/103 , Y02E10/50
摘要： A semiconductor photodetection element SP has a silicon substrate 21 comprised of a semiconductor of a first conductivity type, having a first principal surface 21a and a second principal surface 21b opposed to each other, and having a semiconductor layer 23 of a second conductivity type formed on the first principal surface 21a side; and charge transfer electrodes 25 provided on the first principal surface 21a and adapted to transfer generated charge. In the silicon substrate 21, an accumulation layer 31 of the first conductivity type having a higher impurity concentration than the silicon substrate 21 is formed on the second principal surface 21b side and an irregular asperity 10 is formed in a region opposed to at least the semiconductor region 23, in the second principal surface 21b. The region where the irregular asperity 10 is formed in the second principal surface 21b of the silicon substrate 21 is optically exposed.
摘要翻译： 半导体光检测元件SP具有由第一导电类型的半导体构成的硅基板21，第一导电类型的半导体具有彼此相对的第一主表面21a和第二主表面21b，并且具有第二导电类型的半导体层23形成在 第一主表面21a侧; 以及设置在第一主表面21a上并适于传送产生的电荷的电荷转移电极25。 在硅基板21中，在第二主面21b侧形成有比硅基板21高的杂质浓度的第一导电类型的累积层31，并且在与至少半导体相对的区域中形成不规则的凹凸10 区域23，在第二主表面21b中。 在硅衬底21的第二主表面21b中形成不规则凹凸10的区域被光学曝光。
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公开(公告)号：US20110291218A1
公开(公告)日：2011-12-01
申请号：US13147884
申请日：2010-02-15
IPC分类号： H01L27/146 , H01L31/09
CPC分类号： H01L27/1464 , H01L27/1462 , H01L27/14625 , H01L27/1463 , H01L27/14649 , H01L27/14689 , H01L31/0232 , H01L31/0236 , H01L31/02363 , H01L31/035281 , H01L31/103 , H01L31/107 , H01L2224/48091 , Y02E10/50 , H01L2924/00014
摘要： A photodiode array PDA1 is provided with a substrate S wherein a plurality of photodetecting channels CH have an n-type semiconductor layer 32. The photodiode array PDA1 is provided with a p− type semiconductor layer 33 formed on the n-type semiconductor layer 32, resistors 24 provided for the respective photodetecting channels CH and each having one end portion connected to a signal conducting wire 23, and an n-type separating portion 40 formed between the plurality of photodetecting channels CR The p− type semiconductor layer 33 forms pn junctions at an interface to the n-type semiconductor layer 32 and has a plurality of multiplication regions AM for avalanche multiplication of carriers generated with incidence of detection target light, corresponding to the respective photodetecting channels. An irregular asperity 10 is formed in a surface of the n-type semiconductor layer 32 and the surface is optically exposed.
摘要翻译： 光电二极管阵列PDA1设置有基板S，其中多个受光通道CH具有n型半导体层32.光电二极管阵列PDA1设置有形成在n型半导体层32上的p型半导体层33，电阻 设置在相应的光检测通道CH上，并且每个具有连接到信号导线23的一个端部，以及形成在多个光电通道CR之间的n型分离部分40. p型半导体层33形成在p型结 与n型半导体层32接口，并且具有多个乘法区域AM，用于与检测目标光入射产生的载流子的雪崩乘法相对应的各个受光通道。 在n型半导体层32的表面上形成不规则的凹凸10，并且该表面被光学曝光。
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公开(公告)号：US20110291213A1
公开(公告)日：2011-12-01
申请号：US13148091
申请日：2010-02-15
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L31/1804 , H01L31/02327 , H01L31/02363 , H01L31/035281 , Y02E10/547
摘要： A semiconductor substrate 2 is dry etched before an insulating layer 4 is exposed, whereby a hole H1 penetrating through the semiconductor substrate 2 and reaching the insulating layer 4 is formed at a position corresponding to a photosensitive region S1. Next, an irregular asperity 22 is formed in a surface 7 of an n+ type embedded layer 6 exposed in the hole H1. The surface of the n+ type embedded layer 6 exposed in the hole H1 through the insulating layer 4 is irradiated with a picosecond to femtosecond pulsed laser beam, whereby the insulating layer 4 is removed and the surface 7 of the n+ type embedded layer 6 exposed in the hole H1 is roughened by the picosecond to femtosecond pulsed laser beam, to form the irregular asperity 22 in the entire area of the surface 7. Then the substrate with the irregular asperity 22 therein is subjected to a thermal treatment.
摘要翻译： 在绝缘层4露出之前对半导体衬底2进行干蚀刻，从而在对应于感光区域S1的位置处形成贯穿半导体衬底2并到达绝缘层4的孔H1。 接下来，在露出在孔H1中的n +型嵌入层6的表面7中形成不规则的凹凸22。 通过绝缘层4暴露在孔H1中的n +型嵌入层6的表面用皮秒照射到飞秒脉冲激光束，由此去除绝缘层4，并将n +型嵌入层6的表面7暴露在 通过皮秒对飞秒脉冲激光束使孔H1粗糙化，在表面7的整个区域中形成不规则的凹凸22。然后对其中具有不规则凹凸22的基底进行热处理。
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