发明授权
- 专利标题: Light detection device having a semiconductor light detection element, a mounting substrate, a glass substrate and a plurality of through-hole electrodes electrically connected to quenching resistors
- 专利标题(中): 具有半导体光检测元件,安装基板,玻璃基板以及电连接到淬火电阻器的多个通孔电极的光检测装置
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申请号: US14352429申请日: 2012-08-02
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公开(公告)号: US09435686B2公开(公告)日: 2016-09-06
- 发明人: Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
- 申请人: Terumasa Nagano , Noburo Hosokawa , Tomofumi Suzuki , Takashi Baba
- 申请人地址: JP Hamamatsu-shi, Shizuoka
- 专利权人: HAMAMATSU PHOTONICS K.K.
- 当前专利权人: HAMAMATSU PHOTONICS K.K.
- 当前专利权人地址: JP Hamamatsu-shi, Shizuoka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2011-232106 20111021
- 国际申请: PCT/JP2012/069730 WO 20120802
- 国际公布: WO2013/058003 WO 20130425
- 主分类号: G01J1/42
- IPC分类号: G01J1/42 ; H01L27/144 ; H01L31/107 ; H01L27/146 ; G01T1/208 ; H01L31/0224
摘要:
A semiconductor light detection element includes a plurality of avalanche photodiodes operating in Geiger mode and formed in a semiconductor substrate, quenching resistors connected in series to the respective avalanche photodiodes and arranged on a first principal surface side of the semiconductor substrate, and a plurality of through-hole electrodes electrically connected to the quenching resistors and formed so as to penetrate the semiconductor substrate from the first principal surface side to a second principal surface side. A mounting substrate includes a plurality of electrodes arranged corresponding to the respective through-hole electrodes on a third principal surface side. The through-hole electrodes and the electrodes are electrically connected through bump electrodes, and a side surface of the semiconductor substrate and a side surface of a glass substrate are flush with each other.
公开/授权文献
- US20140263975A1 LIGHT DETECTION DEVICE 公开/授权日:2014-09-18
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