发明授权
- 专利标题: Substrate processing apparatus and method of manufacturing semiconductor device
- 专利标题(中): 基板处理装置及半导体装置的制造方法
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申请号: US12631152申请日: 2009-12-04
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公开(公告)号: US09437465B2公开(公告)日: 2016-09-06
- 发明人: Satoru Takahata , Yukio Ozaki , Reizo Nunozawa
- 申请人: Satoru Takahata , Yukio Ozaki , Reizo Nunozawa
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Kokusai Electric Inc.
- 当前专利权人: Hitachi Kokusai Electric Inc.
- 当前专利权人地址: JP Tokyo
- 代理机构: Brundidge & Stanger, P.C.
- 优先权: JP2008-313854 20081210
- 主分类号: H01L21/203
- IPC分类号: H01L21/203 ; H01L21/67 ; C23C16/52 ; C23C16/54 ; G05B19/4063 ; G05B19/418
摘要:
When a step is delayed, an operator can be rapidly informed of the delay. A substrate processing apparatus comprises a process system configured to process a substrate; a control unit configured to control the process system for performing a plurality of steps; and a manipulation unit configured to monitor a progress of each of the plurality of steps, wherein when a time elapsed after the control unit goes into a hold state exceeds an allowable time previously allocated to the one of the plurality of steps while waiting for a completion of the one of the plurality of steps started by the process system, the control unit transmits an alarm message to the manipulation unit so as to inform the manipulation unit that the allowable time is exceeded, terminates the hold state, and performs a recovery action.
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