Invention Grant
- Patent Title: Semiconductor device having buried gate structure and method of fabricating the same
- Patent Title (中): 具有掩埋栅极结构的半导体器件及其制造方法
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Application No.: US14551857Application Date: 2014-11-24
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Publication No.: US09437697B2Publication Date: 2016-09-06
- Inventor: Min-Hee Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2014-0061198 20140521
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L29/49

Abstract:
A semiconductor device includes a device isolation region defining an active region in a substrate, and gate structures buried in the active region of the substrate. At least one of the gate structures includes a gate trench, a gate insulating layer conformally formed on an inner wall of the gate trench, a gate barrier pattern conformally formed on the gate insulating layer disposed on a lower portion of the gate trench, a gate electrode pattern formed on the gate barrier pattern and filling the lower portion of the gate trench, an electrode protection layer conformally formed on the gate insulating layer disposed on an upper portion of the gate trench to be in contact with the gate barrier pattern and the gate electrode pattern, a buffer oxide layer conformally formed on the electrode protection layer, and a gate capping insulating layer formed on the buffer oxide layer to fill the upper portion of the gate trench.
Public/Granted literature
- US20150340453A1 SEMICONDUCTOR DEVICE HAVING BURIED GATE STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-11-26
Information query
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