Invention Grant
- Patent Title: Optical module and fabrication method thereof
- Patent Title (中): 光模块及其制造方法
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Application No.: US14557985Application Date: 2014-12-02
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Publication No.: US09438345B2Publication Date: 2016-09-06
- Inventor: Liping Wang , Xiquan Dai
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Staas & Halsey LLP
- Priority: CN201310155648 20130428
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H04B10/27 ; G02F1/17 ; H04B10/50 ; H04B10/564 ; H01S5/026 ; H04J14/00 ; H01S5/00 ; H01S5/50 ; H01S5/022

Abstract:
The optical module includes an optical component, a substrate, and a laser, an electro-absorption modulator, and a semiconductor optical amplifier that grow on the substrate, where: the electro-absorption modulator is located between the laser and the semiconductor optical amplifier; the laser is configured to output an optical signal after power-on; the electro-absorption modulator is configured to perform signal modulation on the optical signal output by the laser; the semiconductor optical amplifier is configured to amplify the optical signal modulated by the electro-absorption modulator; the optical component is configured to perform deflection and convergence for the optical signal amplified by the semiconductor optical amplifier and output the optical signal.
Public/Granted literature
- US20150131995A1 OPTICAL MODULE AND FRABRICATION METHOD THEREOF Public/Granted day:2015-05-14
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