Invention Grant
- Patent Title: Film-forming apparatus
- Patent Title (中): 成膜装置
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Application No.: US14388307Application Date: 2013-03-18
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Publication No.: US09441293B2Publication Date: 2016-09-13
- Inventor: Tetsuya Saitou
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2012-081729 20120330
- International Application: PCT/JP2013/001831 WO 20130318
- International Announcement: WO2013/145630 WO 20131003
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/306 ; C23C16/455 ; C23C16/34 ; C23C16/44 ; C23C16/458

Abstract:
A film-forming apparatus forms a film by sequentially supplying a plurality of kinds of reaction gases to a substrate placed between a placing unit and a ceiling plate in a processing chamber having vacuum atmosphere and supplying a replacement gas between supply of one reaction gas and supply of next reaction gas. A central gas ejecting unit is disposed above the central portion of the substrate, and includes gas ejecting ports formed therein to spread the gases toward the outer side in the horizontal direction. A peripheral gas supply unit is disposed to surround the central gas ejecting unit. The peripheral gas supply unit includes a plurality of gas ejecting ports, which is formed in the circumferential direction such that the gases are spread in the horizontal direction toward the outer circumferential side and the central side of the substrate in a plan view.
Public/Granted literature
- US20150047567A1 FILM-FORMING APPARATUS Public/Granted day:2015-02-19
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