Invention Grant
- Patent Title: Microetching solution for copper, replenishment solution therefor and method for production of wiring board
- Patent Title (中): 铜的微蚀刻解决方案及其配线方法
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Application No.: US14110535Application Date: 2013-03-04
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Publication No.: US09441303B2Publication Date: 2016-09-13
- Inventor: Masayo Kurii , Kiyoto Tai , Mami Nakamura
- Applicant: MEC COMPANY LTD.
- Applicant Address: JP Hyogo
- Assignee: MEC COMPANY LTD.
- Current Assignee: MEC COMPANY LTD.
- Current Assignee Address: JP Hyogo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2012-164006 20120724
- International Application: PCT/JP2013/055843 WO 20130304
- International Announcement: WO2014/017115 WO 20140130
- Main IPC: C09G1/04
- IPC: C09G1/04 ; C09K13/00 ; C23F1/18 ; H05K3/38 ; H05K3/02 ; C23F1/34

Abstract:
Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.
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